Abstract: Techniques are disclosed to determine the temperature-dependent insertion loss and propagation delay of traces in a printed circuit board design. For example, an example method includes determining a first temperature at a first portion of a trace of a PCB design based on a thermal map of the PCB design. The method further includes determining a second temperature at a second portion of the trace based on the thermal map. The method further includes calculating a temperature-dependent property of the PCB at the first portion based on the first temperature. The method further includes calculating the temperature-dependent property of the PCB at the second portion based on the second temperature. The method further includes calculating at least one of a signal loss and propagation delay on the trace based on the temperature-dependent property of the PCB at the first portion and the second portion.

Abstract: In one embodiment, an apparatus includes a contact contained within a connector configured to couple with a mating connection to provide a communications data path through the connector, a ground shroud extending over a portion of the contact, and a self-terminating element connected to one of the contact and the ground shroud and configured for engagement with the other of the contact and the ground shroud when in an engaged position with the connector uncoupled from the mating connection to terminate signals transmitted to the connector, and disengagement when in a disengaged position with the connector coupled with the mating connection.

Abstract: In one embodiment, an apparatus includes a contact contained within a connector configured to couple with a mating connection to provide a communications data path through the connector, a ground shroud extending over a portion of the contact, and a self-terminating element connected to one of the contact and the ground shroud and configured for engagement with the other of the contact and the ground shroud when in an engaged position with the connector uncoupled from the mating connection to terminate signals transmitted to the connector, and disengagement when in a disengaged position with the connector coupled with the mating connection.

Abstract: Techniques are disclosed to determine the temperature-dependent insertion loss and propagation delay of traces in a printed circuit board design. For example, an example method includes determining a first temperature at a first portion of a trace of a PCB design based on a thermal map of the PCB design. The method further includes determining a second temperature at a second portion of the trace based on the thermal map. The method further includes calculating a temperature-dependent property of the PCB at the first portion based on the first temperature. The method further includes calculating the temperature-dependent property of the PCB at the second portion based on the second temperature. The method further includes calculating at least one of a signal loss and propagation delay on the trace based on the temperature-dependent property of the PCB at the first portion and the second portion.

Abstract: In one embodiment, a method includes capturing an image of a piece of a printed circuit board (PCB) that includes at least one inner layer having a metal foil portion. The piece of the PCB includes a cross-section of the inner layer having the metal foil portion. The method also includes determining a surface roughness of the metal foil portion, wherein determining the surface roughness of the metal foil portion includes processing the image.

Abstract: In one embodiment, a method includes capturing an image of a piece of a printed circuit board (PCB) that includes at least one inner layer having a metal foil portion. The piece of the PCB includes a cross-section of the inner layer having the metal foil portion. The method also includes determining a surface roughness of the metal foil portion, wherein determining the surface roughness of the metal foil portion includes processing the image.

Abstract: The present invention is directed to inhibiting amyloidogenic processing of amyloid precursor protein, and/or inhibiting production of amyloid beta peptides. These methods can involve accelerating cis/trans isomerization of amyloid precursor protein at a phosphorylated serine/threonine-proline motif and/or contacting a cell with a compound that mimics the cis conformation of a phosphorylated serine/threonine-proline motif of an amyloid precursor protein. The present invention also relates to treating and/or preventing in a subject a degenerative neurological disease characterized by amyloidogenic processing of amyloid precursor protein and/or overproduction of amyloid beta peptide. This method involves administering an agent that accelerates cis/trans isomerization of amyloid precursor protein at a phosphorylated serine/threonine-proline motif and/or inhibits production of amyloid ? peptides.