Abstract: A tool for an assembly machine comprising a gantry mechanism is disclosed. The tool includes a connector for connecting the tool to the gantry mechanism; a first surface for temporarily interfacing the tool to an optical die; a retention apparatus configured to temporarily couple the optical die to the first surface; and a first tool optical coupler positioned at the first surface and configured to form a first optical connection to the optical die when the optical die is positioned at the first surface.

Abstract: An assembly system for assembling an optical die to an optical substrate includes test equipment configured to test optical couplers formed between the optical die and the optical substrate. The assembly system is configured to adjust an alignment of the optical die relative to the optical substrate until the optical couplers meet a performance metric. After the performance metric is met the optical die is permanently attached to the optical substrate.

Abstract: An assembly system for assembling an optical die to an optical substrate includes test equipment configured to test optical couplers formed between the optical die and the optical substrate. The assembly system is configured to adjust an alignment of the optical die relative to the optical substrate until the optical couplers meet a performance metric. After the performance metric is met the optical die is permanently attached to the optical substrate.

Abstract: An assembly system for assembling an optical die to an optical substrate includes test equipment configured to test optical couplers formed between the optical die and the optical substrate. The assembly system is configured to adjust an alignment of the optical die relative to the optical substrate until the optical couplers meet a performance metric. After the performance metric is met the optical die is permanently attached to the optical substrate.

Abstract: The present disclosure generally relates to an integrated circuit having a stacked embedded passive substrate (EPS) structure formed therein. In particular, a substrate may have a cavity formed therein and the stacked EPS structure may include multiple passive components formed in the cavity to provide separate electrical paths for decoupling of the integrated circuit. Furthermore, the multiple passive components may each have two respective terminals such that the multiple passive components may support different voltage domains. Among other things, compared to conventional die-side and/or land-side passive components, the stacked EPS structure may advantageously reduce a z-axis height of the integrated circuit, reduce manufacturing costs, improve performance due to shorter electrical paths, and improve design routing through x-axis and y-axis space savings.

Abstract: A chip package substrate and methods for fabricating the chip package substrate. An exemplary chip package substrate generally includes a first substrate and a second substrate embedded in the first substrate and having a plurality of layered traces embedded therein.

Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.