Patents by Inventor Soumyajit Routh

Soumyajit Routh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for multi-point thermal path assessment
    Patent number: 11506621
    Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 22, 2022
    Assignee: DELPHI TECHNOLOGIES IP LIMITED
    Inventors: Gregg N. Francisco, Kevin M. Gertiser, Jack L. Glenn, Narendra J. Mane, Thomas E. Pritchett, Soumyajit Routh, Kok Wee Yeo
  • Integrated circuit and method for capturing baseline die temperature data
    Patent number: 11293808
    Abstract: A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 5, 2022
    Assignee: Delphi Technologies IP Limited
    Inventors: Soumyajit Routh, Kevin M. Gertiser, Jack L. Glenn, John Mark Dikeman, Daniel C. Penrod
  • SYSTEM AND METHOD FOR MULTI-POINT THERMAL PATH ASSESSMENT
    Publication number: 20200278309
    Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.
    Type: Application
    Filed: March 1, 2019
    Publication date: September 3, 2020
    Inventors: Gregg N. Francisco, Kevin M. Gertiser, Jack L. Glenn, Narendra J. Mane, Thomas E. Pritchett, Soumyajit Routh, Kok Wee Yeo