Patents by Inventor Soung Soon Chun

Soung Soon Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a thin film of copper
    Patent number: 5817367
    Abstract: A method of forming a thin film of copper on a substrate includes a first step of conducting a chemical vapor deposition (CVD) process using a metal organic (MO) source while applying a first bias voltage to the surface of the substrate and a second step of conducting a chemical vapor deposition process using a metal organic source while applying a second bias voltage to the substrate, wherein the second bias voltage is opposite in polarity to the first bias voltage. The process may include a third step of conducting a chemical vapor deposition process using a metal organic source while applying a third bias voltage to the substrate, where the third bias voltage has the same polarity as the first bias voltage.
    Type: Grant
    Filed: December 23, 1996
    Date of Patent: October 6, 1998
    Assignee: LG Semicon., Ltd.
    Inventors: Soung Soon Chun, Chong Ook Park, Dong Won Kim, Won Jun Lee, Sa Kyun Rha, Kyung Il Lee