Patents by Inventor Sourabh Biswas

Sourabh Biswas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetic weld for a thin film electrochemical cell activated with a solid electrolyte and housed in a ceramic casing
    Patent number: 11527795
    Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both of ceramic casing halves. A thin film metallization, such as of titanium, contacts an edge periphery of each ceramic casing half. The first ceramic casing half is moved into registry with the second ceramic casing half so that the first and second ring-shaped metallizations contact each other.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: December 13, 2022
    Assignee: Greatbatch Ltd.
    Inventors: Robert S. Rubino, Keith W. Seitz, Xiaohong Tang, Todd C. Sutay, Brian P. Hohl, Holly Noelle Moschiano, Biswa P. Das, Afsar Ali, Sourabh Biswas, Gary Freitag, David Dianetti, Ho-Chul Yun, Thomas Marzano
  • HERMETIC WELD FOR A THIN FILM ELECTROCHEMICAL CELL ACTIVATED WITH A SOLID ELECTROLYTE AND HOUSED IN A CERAMIC CASING
    Publication number: 20200185662
    Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both of ceramic casing halves. A thin film metallization, such as of titanium, contacts an edge periphery of each ceramic casing half. The first ceramic casing half is moved into registry with the second ceramic casing half so that the first and second ring-shaped metallizations contact each other.
    Type: Application
    Filed: February 12, 2020
    Publication date: June 11, 2020
    Inventors: Robert S. Rubino, Keith W. Seitz, Xiaohong Tang, Todd C. Sutay, Brian P. Hohl, Holly Noelle Moschiano, Biswa P. Das, Afsar Ali, Sourabh Biswas, Gary Freitag, David Dianetti, Ho-Chul Yun, Thomas Marzano