Patents by Inventor Sourabh Mishra

Sourabh Mishra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-phase polishing pad
    Patent number: 8133096
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: March 13, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • System and method for chemical mechanical planarization
    Patent number: 7048607
    Abstract: Generally, a method and apparatus for processing a substrate. In one embodiment, the method provides a first relative motion between at least a first substrate and a polishing material. A second relative motion is provided between at least a second substrate and the polishing material. The changing in direction of the relative motion extends the interval between conditioning procedures used to return the polishing material to a state that produces uniform polishing results.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: May 23, 2006
    Assignee: Applied Materials
    Inventors: Li Wu, Sourabh Mishra, Young J. Paik, Satyasrayan Kumaraswamy, Robert Lum, Chiu Chan, David Groechel
  • Multi-phase polishing pad
    Publication number: 20050189235
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Application
    Filed: February 22, 2005
    Publication date: September 1, 2005
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • Multi-phase polishing pad
    Patent number: 6857941
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacture may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: February 22, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • Multi-phase polishing pad
    Publication number: 20020197946
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Application
    Filed: May 2, 2002
    Publication date: December 26, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra