Abstract: Provided herein are direct evaporative cooling devices and systems that are in open and closed configurations for cooling hot solid components. The devices in both configurations generally have a casing with a perforated surface where sealed within are a water/vapor separator with a reservoir volume and a thermally conductive media therein through which heat evaporates water within the media such that evaporation cools the hot solid component. The closed configuration of the device includes a condensor to receive, recondense the vapor to water and re-inject the water into the reservoir volume.

Abstract: Multi version library cell handling and integrated circuit structures fabricated therefrom are described. In an example, an integrated circuit structure includes a plurality of gate lines parallel along a first direction of a substrate and having a pitch along a second direction orthogonal to the first direction. A first version of a cell type is over a first portion of the plurality of gate lines, the first version of the cell type including a first plurality of interconnect lines having a second pitch along the second direction, the second pitch less than the first pitch.

Abstract: Multi version library cell handling and integrated circuit structures fabricated therefrom are described. In an example, an integrated circuit structure includes a plurality of gate lines parallel along a first direction of a substrate and having a pitch along a second direction orthogonal to the first direction. A first version of a cell type is over a first portion of the plurality of gate lines, the first version of the cell type including a first plurality of interconnect lines having a second pitch along the second direction, the second pitch less than the first pitch.

Abstract: An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.

Abstract: Embodiments of the present invention provide a method, apparatus and system for inductance modeling. According to some exemplary embodiments, a method for inductance modeling may include determining a plurality of two-dimensional mutual inductance values corresponding to a designated victim within a geometrical event and a plurality of designated attackers, respectively. Other embodiments are described and claimed.

Abstract: A closed-loop based timing signal distribution architecture includes at least one signal source coupled to a signal path disposed in a closed loop arrangement to facilitate generation of a standing wave signal within the signal path. In one embodiment, at least one receiver is coupled to the signal path to generate at least one digital clock signal based upon the standing wave signal.

Abstract: Embodiments of the present invention provide a method, apparatus and system for inductance modeling. According to some exemplary embodiments, a method for inductance modeling may include determining a plurality of two-dimensional mutual inductance values corresponding to a designated victim within a geometrical event and a plurality of designated attackers, respectively. Other embodiments are described and claimed.

Abstract: A closed-loop based timing signal distribution architecture includes at least one signal source coupled to a signal path disposed in a closed loop arrangement to facilitate generation of a standing wave signal within the signal path. In one embodiment, at least one receiver is coupled to the signal path to generate at least one digital clock signal based upon the standing wave signal.