Patents by Inventor Sourav Chakravarty

Sourav Chakravarty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220149075
    Abstract: Multi version library cell handling and integrated circuit structures fabricated therefrom are described. In an example, an integrated circuit structure includes a plurality of gate lines parallel along a first direction of a substrate and having a pitch along a second direction orthogonal to the first direction. A first version of a cell type is over a first portion of the plurality of gate lines, the first version of the cell type including a first plurality of interconnect lines having a second pitch along the second direction, the second pitch less than the first pitch.
    Type: Application
    Filed: January 26, 2022
    Publication date: May 12, 2022
    Inventors: Ranjith KUMAR, Quan SHI, Mark T. BOHR, Andrew W. YEOH, Sourav CHAKRAVARTY, Barbara A. CHAPPELL, M. Clair WEBB
  • Patent number: 11271010
    Abstract: Multi version library cell handling and integrated circuit structures fabricated therefrom are described. In an example, an integrated circuit structure includes a plurality of gate lines parallel along a first direction of a substrate and having a pitch along a second direction orthogonal to the first direction. A first version of a cell type is over a first portion of the plurality of gate lines, the first version of the cell type including a first plurality of interconnect lines having a second pitch along the second direction, the second pitch less than the first pitch.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: March 8, 2022
    Assignee: Intel Corporation
    Inventors: Ranjith Kumar, Quan Shi, Mark T. Bohr, Andrew W. Yeoh, Sourav Chakravarty, Barbara A. Chappell, M. Clair Webb
  • Patent number: 11068640
    Abstract: An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: July 20, 2021
    Assignee: Intel Corporation
    Inventors: Ranjith Kumar, Mark T. Bohr, Ruth A. Brain, Marni Nabors, Tai-Hsuan Wu, Sourav Chakravarty
  • Publication number: 20200357823
    Abstract: Multi version library cell handling and integrated circuit structures fabricated therefrom are described. In an example, an integrated circuit structure includes a plurality of gate lines parallel along a first direction of a substrate and having a pitch along a second direction orthogonal to the first direction. A first version of a cell type is over a first portion of the plurality of gate lines, the first version of the cell type including a first plurality of interconnect lines having a second pitch along the second direction, the second pitch less than the first pitch.
    Type: Application
    Filed: September 20, 2017
    Publication date: November 12, 2020
    Inventors: Ranjith KUMAR, Quan SHI, Mark T. BOHR, Andrew W. YEOH, Sourav CHAKRAVARTY, Barbara A. CHAPPELL, M. Clair WEBB
  • Publication number: 20200279069
    Abstract: An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.
    Type: Application
    Filed: December 28, 2017
    Publication date: September 3, 2020
    Inventors: Ranjith KUMAR, Mark T. BOHR, Ruth A. BRAIN, Marni NABORS, Tai-Hsuan WU, Sourav CHAKRAVARTY
  • Patent number: 7325208
    Abstract: Embodiments of the present invention provide a method, apparatus and system for inductance modeling. According to some exemplary embodiments, a method for inductance modeling may include determining a plurality of two-dimensional mutual inductance values corresponding to a designated victim within a geometrical event and a plurality of designated attackers, respectively. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: January 29, 2008
    Assignee: Intel Corporation
    Inventors: Sourav Chakravarty, Yaakov Ben-Noon, Eli Chiprout, Mohiuddin Mazumder, Dmitry Messerman
  • Patent number: 7120817
    Abstract: A closed-loop based timing signal distribution architecture includes at least one signal source coupled to a signal path disposed in a closed loop arrangement to facilitate generation of a standing wave signal within the signal path. In one embodiment, at least one receiver is coupled to the signal path to generate at least one digital clock signal based upon the standing wave signal.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: October 10, 2006
    Assignee: Intel Corporation
    Inventors: Mauro J. Kobrinsky, Sourav Chakravarty, R. Scott List
  • Publication number: 20060074617
    Abstract: Embodiments of the present invention provide a method, apparatus and system for inductance modeling. According to some exemplary embodiments, a method for inductance modeling may include determining a plurality of two-dimensional mutual inductance values corresponding to a designated victim within a geometrical event and a plurality of designated attackers, respectively. Other embodiments are described and claimed.
    Type: Application
    Filed: September 28, 2004
    Publication date: April 6, 2006
    Inventors: Sourav Chakravarty, Yaakov Ben-Noon, Eli Chiprout, Mohiuddin Mazumder, Dmitry Messerman
  • Publication number: 20040243873
    Abstract: A closed-loop based timing signal distribution architecture includes at least one signal source coupled to a signal path disposed in a closed loop arrangement to facilitate generation of a standing wave signal within the signal path. In one embodiment, at least one receiver is coupled to the signal path to generate at least one digital clock signal based upon the standing wave signal.
    Type: Application
    Filed: May 29, 2003
    Publication date: December 2, 2004
    Inventors: Mauro J. Kobrinsky, Sourav Chakravarty, R. Scott List