Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. In one example, the apparatus includes memory, instructions, and processor circuitry to instantiate or execute the machine readable instructions to determine a design block associated with a design exception, parse the design block into a functional netlist of cell families, generate a cell occurrence counts distribution, and group cell families into cell family bins corresponding to fabrication parameters. The processor circuitry further determines inclusion of a first cell family bin does not improve one or more process technology attribute values and causes a user interface to indicate the first cell family bin as a cell family bin candidate for removal from the functional netlist.

Abstract: A computing device, includes one or more processors, configured to receive first data corresponding to a first radiofrequency signal received from a first wireless communication device, and second data corresponding to a second radiofrequency signal received from a second wireless communication device; select either the first wireless communication device or the second wireless communication device as a repeater device based on the first data or the second data according to one or more repeater selection criteria; instruct a transceiver to send a third radiofrequency signal to the repeater device, wherein the third radiofrequency signal comprises third data and an instruction for the repeater device to repeat the third data to the third wireless communication device.

Abstract: A contact lens comprising one or more microchannels for transport of liquid through the lens is provided. The contact lens can be made by contacting a curable composition with a microfiber that is insoluble in the curable composition; curing the curable composition to provide a polymeric lens body with the microfiber embedded therein; and contacting the polymeric lens body with a solvent to dissolve the microfiber.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for methods and apparatus to generate I/O timing constraint predictions for system-on-chips using machine learning. An apparatus is disclosed herein comprising at least one memory, machine readable instructions, and processor circuitry to at least one of instantiate or execute the machine readable instructions to extract delay features from a first system-on-chip design and a second system-on-chip design, apply a machine learning model to the extracted delay features to determine an estimated delay for the first system-on-chip design, compare the estimated delay for the first system-on-chip design to the second system-on-chip design to determine an error of the first system-on-chip design, and update the second system-on-chip design based on the error determined for the first system-on-chip design.

Abstract: Methods of manufacturing an ophthalmic lens are described. The methods include a step of providing an ophthalmic lens; and a step of providing a photocurable film. The methods use a digital light projections system to photocure at least one region of the film to produce at least one photocured gradient index refractive element. The film is applied to a surface of the lens.

Abstract: Microchannels in hydrogels play an essential role in enabling a smart contact lens. A wearable contact lens is disclosed herein that uses microchannels and connected chambers located in poly-2-hydroxyethyl methacrylate (poly(HEMA)) hydrogel that is used in a commercial contact lens with three-dimensional (3D) printed mold. The corresponding capillary flow behaviors in these microchannels were investigated. Different capillary flow regimes were observed in these microchannels, depending on the hydration level of the hydrogel material. In particular, it was found that a peristaltic pressure could reinstate flow in a dehydrated microchannel, indicating the motion of eye-blinking may help tear flow in a microchannel-containing contact lens. Colorimetric pH and electrochemical Na+ sensing capabilities were demonstrated in these microchannels. Micro-engineered contact lenses formed using poly(HEMA) hydrogel can be used for various biomedical applications such as eye-care and wearable biosensing.

Abstract: A contact lens having dimples on a posterior surface is described as well as cast molds and injection molding inserts for manufacturing the same. The contact lens includes a posterior surface having an optic zone, a peripheral zone, and a circumferential edge, where dimples are located in the peripheral zone, and can include at least 1000 dimples.

Abstract: A contact lens comprising one or more microchannels for transport of liquid through the lens is provided. The contact lens can be made by contacting a curable composition with a microfiber that is insoluble in the curable composition; curing the curable composition to provide a polymeric lens body with the microfiber embedded therein; and contacting the polymeric lens body with a solvent to dissolve the microfiber.

Abstract: Ophthalmic lenses are described that have a layer, which has a base refractive index, provided on a surface of the lens. The layer includes at least one gradient index optical element. The ophthalmic lens may be a spectacle lens or a contact lens.

Abstract: Methods of manufacturing an ophthalmic lens are described. The methods include a step of providing an ophthalmic lens; and a step of providing a photocurable film. The methods use a digital light projections system to photocure at least one region of the film to produce at least one photocured gradient index refractive element. The film is applied to a surface of the lens.

Abstract: A film for applying to an ophthalmic lens is described. The film, or the combination of the film and the ophthalmic lens are designed to prevent or slow the development or progression of myopia. The film has a base refractive index and includes at least one gradient index optical element. Ophthalmic lenses, such as spectacle lenses and contact lenses, that include the films are also described.

Abstract: A contact lens comprising one or more microchannels for transport of liquid through the lens is provided. The contact lens can be made by contacting a curable composition with a microfiber that is insoluble in the curable composition; curing the curable composition to provide a polymeric lens body with the microfiber embedded therein; and contacting the polymeric lens body with a solvent to dissolve the microfiber.

Abstract: A contact lens having dimples on a posterior surface is described as well as cast molds and injection molding inserts for manufacturing the same. The contact lens includes a posterior surface having an optic zone, a peripheral zone, and a circumferential edge, where dimples are located in the peripheral zone, and can include at least 1000 dimples.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: A contact lens comprising one or more microchannels for transport of liquid through the lens is provided. The contact lens can be made by contacting a curable composition with a microfiber that is insoluble in the curable composition; curing the curable composition to provide a polymeric lens body with the microfiber embedded therein; and contacting the polymeric lens body with a solvent to dissolve the microfiber.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.