Patents by Inventor Soutarou Ooi

Soutarou Ooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink
    Patent number: 11478868
    Abstract: A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TD of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: October 25, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ryouhei Yumoto, Yoshiyuki Nagatomo, Soutarou Ooi
  • METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEATSINK
    Publication number: 20200009671
    Abstract: A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TD of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.
    Type: Application
    Filed: February 28, 2018
    Publication date: January 9, 2020
    Inventors: Ryouhei Yumoto, Yoshiyuki Nagatomo, Soutarou Ooi