Abstract: A method and system for three-dimensional reconstruction of material properties of a target using remotely located physical sensors is disclosed. The special technique disclosed here, enables an order of magnitude improvement in computational speed and memory requirements over current state-of-the-art artificial intelligence-based systems. When compared against state-of-the-art methods that do not use artificial intelligence, the improvement in accuracy and resolution enables deployment of order of magnitude cheaper data acquisition systems and/or provide the practical capability to image targets previously considered out-of-bounds.

Abstract: A method for determining a location of a proppant in a subterranean formation includes obtaining a first set of data in a wellbore using a downhole tool. The proppant is pumped into the wellbore after the first set of data is obtained. The proppant is pumped while or after the subterranean formation is fractured. A second set of data is obtained in the wellbore using the downhole tool after the proppant is pumped into the wellbore. The first set of data and the second set of data include a gravitational field measurement. The first and second sets of data are compared, and in response to the comparison, the location of the proppant in the subterranean formation is determined.

Abstract: A method for determining a location of a proppant in a subterranean formation includes obtaining a first set of data in a wellbore using a downhole tool. The proppant is pumped into the wellbore after the first set of data is obtained. The proppant is pumped while or after the subterranean formation is fractured. A second set of data is obtained in the wellbore using the downhole tool after the proppant is pumped into the wellbore. The first set of data and the second set of data include a gravitational field measurement. The first and second sets of data are compared, and in response to the comparison, the location of the proppant in the subterranean formation is determined.

Abstract: A method includes acquiring a first set of data before a proppant is pumped into a wellbore. The method also includes acquiring a second set of data after the proppant is pumped into the wellbore. The method also includes determining a weighted average median of the first set of data and of the second set of data. The method also includes determining a location of the proppant in a subterranean formation based at least partially upon the weighted average medians.

Abstract: A method for determining a location of a proppant in a subterranean formation includes obtaining a first set of data in a wellbore using a downhole tool. The proppant is pumped into the wellbore after the first set of data is obtained. The proppant is pumped while or after the subterranean formation is fractured. A second set of data is obtained in the wellbore using the downhole tool after the proppant is pumped into the wellbore. The first set of data and the second set of data include a gravitational field measurement. The first and second sets of data are compared, and in response to the comparison, the location of the proppant in the subterranean formation is determined.

Abstract: A method for determining a location of a proppant in a subterranean formation includes obtaining a first set of data in a wellbore using a downhole tool. The proppant is pumped into the wellbore after the first set of data is obtained. The proppant is pumped while or after the subterranean formation is fractured. A second set of data is obtained in the wellbore using the downhole tool after the proppant is pumped into the wellbore. The first set of data and the second set of data include a gravitational field measurement. The first and second sets of data are compared, and in response to the comparison, the location of the proppant in the subterranean formation is determined.

Abstract: A method includes acquiring a first set of data before a proppant is pumped into a wellbore. The method also includes acquiring a second set of data after the proppant is pumped into the wellbore. The method also includes determining a weighted average median of the first set of data and of the second set of data. The method also includes determining a location of the proppant in a subterranean formation based at least partially upon the weighted average medians.

Abstract: A method for determining a location of a proppant in a subterranean formation includes obtaining a first set of data in a wellbore using a downhole tool. The proppant is pumped into the wellbore after the first set of data is obtained. The proppant is pumped while or after the subterranean formation is fractured. A second set of data is obtained in the wellbore using the downhole tool after the proppant is pumped into the wellbore. The first set of data and the second set of data include a gravitational field measurement. The first and second sets of data are compared, and in response to the comparison, the location of the proppant in the subterranean formation is determined.

Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads.

Abstract: A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.

Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads.

Abstract: A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.

Abstract: A semiconductor chip (101) with bond pads (110) on a substrate (103) with rows and columns of regularly pitched metal contact pads (131). A zone comprises a first pair (131a, 131b) and a parallel second pair (131c, 131d) of contact pads, and a single contact pad (131e) for ground potential; staggered pairs of stitch pads (133) connected to respective pairs of adjacent contact pads by parallel and equal-length traces (132a, 132b, etc.). Parallel and equal-length bonding wires (120a, 120b, etc.) connect bond pad pairs to stitch pad pairs, forming differential pairs of parallel and equal-length conductor lines. Two differential pairs in parallel and symmetrical position form a transmitter/receiver cell for conducting high-frequency signals.

Abstract: A semiconductor chip (101) with bond pads (110) on a substrate (103) with rows and columns of regularly pitched metal contact pads (131). A zone comprises a first pair (131a, 131b) and a parallel second pair (131c, 131d) of contact pads, and a single contact pad (131e) for ground potential; staggered pairs of stitch pads (133) connected to respective pairs of adjacent contact pads by parallel and equal-length traces (132a, 132b, etc.). Parallel and equal-length bonding wires (120a, 120b, etc.) connect bond pad pairs to stitch pad pairs, forming differential pairs of parallel and equal-length conductor lines. Two differential pairs in parallel and symmetrical position form a transmitter/receiver cell for conducting high-frequency signals.

Abstract: An integrated circuit (IC) device (200) includes an electronic substrate (201) having a plurality of layers (120) including at least one first electrically conductive layer and a lower surface dielectric layer. The IC device also includes an electrically conductive surface layer (126) disposed on the dielectric layer and coupled to a ground terminal (210) for the electronic substrate (201) for blocking electromagnetic interference (EMI). In the IC device, the conductive surface layer (126) includes an EMI shield region (204) over at least a portion of the dielectric layer. The EMI shield region (204) includes at least one solid area (206) and one or more adhesion areas (207) having a plurality of openings (208) arranged aperiodically in the adhesion areas (207).