Abstract: To provide a heat sink material that not only is excellent in heat sink properties, but also allows molded articles of various shapes made of a variety of materials to be used as a base substrate of the heat sink material. The heat sink material is also excellent in durability when in use as a heat sink material and can be thinned, and can be conveniently utilized for semiconductor devices, particularly for cell phones, personal computers and the like. The heat sink material includes a composite electroplated film having a plated metal film as a matrix wherein diamond particles are co-deposited in the matrix in such a way that a co-deposition amount of the particles gradually changes in a thickness direction of the plated metal film.

Abstract: A fluorine compound-containing composite material consists essentially of a metal or polymer matrix and particles or fibers of a polytetrafluoroethylene oligomer having a number average molecular weight of 10,000 or less, the proportion of the number of fluorine atoms to the number of the total atoms at the surface portion of the composite material being 40% or more.

Abstract: A fluorine compound-containing composite material consists essentially of a metal or polymer matrix and particles or fibers of a polytetrafluoroethylene oligomer having a number average molecular weight of 10,000 or less, the proportion of the number of fluorine atoms to the number of the total atoms at the surface portion of the composite material being 40% or more.

Abstract: A composite deposit in which insoluble particles are co-deposited and dispersed in a metal matrix is formed on an article by dipping the article in a metal plating solution having insoluble particles dispersed therein and effecting an electroplating or chemical plating process. By adjusting the specific surface area of insoluble particles to be dispersed in the metal plating solution, the amount of insoluble particles co-deposited in the composite deposit can be controlled. Better results are obtained with insoluble particles having a specific surface area of 10 m.sup.2 /g or less.

Abstract: A composite plating apparatus includes a plating tank for receiving therein a composite plating solution containing water-insoluble particles or fibers and a reservoir disposed adjacent the plating tank through an overflow weir, preferably in a common housing, the plating solution flowing into the reservoir in an overflow manner. A pump is disposed within the reservoir having a suction port for drawing the solution in the reservoir and a discharge port for pumping the solution. A conduit connected to the pump discharge port extends therefrom over the bottom of the plating tank through the overflow weir and includes a plurality of orifices. The plating solution is circulated by causing the solution to flow over the weir from the plating tank to the reservoir, pumping the solution to the conduit, and injecting the solution into the tank through the orifices to uniformly agitate the solution.

Abstract: Disclosed is a composite plating film for sliding members, essentially containing at least one of the alloy elements selected from tin, indium, antimony, and copper; inorganic particles; and lead; the composition of the composite plating film being:a) at least one of the alloy elements selected from tin, indium, antimony, and copper . . . 2 to 30 weight % in total;b) inorganic particles . . . 0.3 to 25 volume %; andc) lead . . . the balance.

Abstract: A rocket engine combustion chamber is defined by a generally cylindrical member comprising a metal matrix and heat insulating particles wherein the particles are distributed in the matrix such that the amount of particles gradually decreases in a radial direction from the inner surface to the outer surface of the member. Such a member is manufactured by controlled composite electroplating.

Abstract: A method for codepositing a water-insoluble material with a metal from a plating solution having the metal ion dissolved and the water-insoluble material suspended therein, characterized by pumping at least one third per minute of the volume of the plating solution by means of a pump without entraining air bubbles, and injecting the thus pumped volume downward into the bath through a plurality of holes in the lower side of a sparger pipe connected to said pump and located at a lower level in a plating tank, thereby circulating and fluidizing the plating solution in which codeposition is being carried out.