Patents by Inventor So-Yeon Yun

So-Yeon Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DISPLAY DEVICE
    Publication number: 20240122037
    Abstract: A display device includes a substrate that includes a display area and a non-display area, a display element layer disposed on the display area of the substrate, an opposing substrate that faces the substrate and the display element layer, a sealing member disposed on the non-display area and that couples the substrate and the opposing substrate, and a filler disposed between the substrate and the opposing substrate. A thickness of the filler varies in the range of 60% to 400% of a thickness of the sealing member.
    Type: Application
    Filed: June 21, 2023
    Publication date: April 11, 2024
    Inventors: Jae Heung HA, Jong Woo KIM, So Young OH, Woo Suk JUNG, Hee Yeon PARK, Chang Yeong SONG, Jong Kwang YUN
  • Apparatus and method for manufacturing semiconductor devices through layer material dimension analysis
    Patent number: 8551791
    Abstract: Apparatus and method for manufacturing a semiconductor device through a layer material dimension analysis increase productivity. The method includes performing a semiconductor manufacturing process of at least one reference substrate and at least one target substrate in a semiconductor process device, detecting a reference spectrum and a reference profile for the reference substrate, determining a relation function between the detected reference spectrum and reference profile, detecting a real-time spectrum of the target substrate, and determining in real time a real-time profile of the target substrate processed in the semiconductor process device by using the detected real-time spectrum as a variable in the determined relation function.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: October 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Ik Park, Chung-Sam Jun, Hwan-Shik Park, Ji-Hye Kim, Kwan-Woo Ryu, Kong-Jung Sa, So-Yeon Yun
  • Apparatus and method for manufacturing semiconductor devices through layer material dimension analysis
    Publication number: 20090325326
    Abstract: Apparatus and method for manufacturing a semiconductor device through a layer material dimension analysis increase productivity. The method includes performing a semiconductor manufacturing process of at least one reference substrate and at least one target substrate in a semiconductor process device, detecting a reference spectrum and a reference profile for the reference substrate, determining a relation function between the detected reference spectrum and reference profile, detecting a real-time spectrum of the target substrate, and determining in real time a real-time profile of the target substrate processed in the semiconductor process device by using the detected real-time spectrum as a variable in the determined relation function.
    Type: Application
    Filed: June 24, 2009
    Publication date: December 31, 2009
    Inventors: Jang-Ik Park, Chung-Sam Jun, Hwan-Shik Park, Ji-Hye Kim, Kwan-Woo Ryu, Kong-Jung Sa, So-Yeon Yun