Patents by Inventor So-Yeon Yun

So-Yeon Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250207275
    Abstract: According to the present invention, there is provided a method of manufacturing a metal and metal nitride using a single-step nitridation-exsolution synthetic method, including synthesizing metal-substituted metal oxide nanoparticles (S100); synthesizing metal-substituted metal oxide nanowires through hydrothermal synthesis of the metal-substituted metal oxide nanoparticles (S200); and obtaining a metal nitride and exsolved metal through ammonia treatment of the metal-substituted metal oxide nanowires (S300).
    Type: Application
    Filed: December 4, 2024
    Publication date: June 26, 2025
    Applicant: UIF (University Industry Foundation), Yonsei University
    Inventors: Seong-Ju HWANG, So Yeon YUN
  • Patent number: 8551791
    Abstract: Apparatus and method for manufacturing a semiconductor device through a layer material dimension analysis increase productivity. The method includes performing a semiconductor manufacturing process of at least one reference substrate and at least one target substrate in a semiconductor process device, detecting a reference spectrum and a reference profile for the reference substrate, determining a relation function between the detected reference spectrum and reference profile, detecting a real-time spectrum of the target substrate, and determining in real time a real-time profile of the target substrate processed in the semiconductor process device by using the detected real-time spectrum as a variable in the determined relation function.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: October 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Ik Park, Chung-Sam Jun, Hwan-Shik Park, Ji-Hye Kim, Kwan-Woo Ryu, Kong-Jung Sa, So-Yeon Yun
  • Publication number: 20090325326
    Abstract: Apparatus and method for manufacturing a semiconductor device through a layer material dimension analysis increase productivity. The method includes performing a semiconductor manufacturing process of at least one reference substrate and at least one target substrate in a semiconductor process device, detecting a reference spectrum and a reference profile for the reference substrate, determining a relation function between the detected reference spectrum and reference profile, detecting a real-time spectrum of the target substrate, and determining in real time a real-time profile of the target substrate processed in the semiconductor process device by using the detected real-time spectrum as a variable in the determined relation function.
    Type: Application
    Filed: June 24, 2009
    Publication date: December 31, 2009
    Inventors: Jang-Ik Park, Chung-Sam Jun, Hwan-Shik Park, Ji-Hye Kim, Kwan-Woo Ryu, Kong-Jung Sa, So-Yeon Yun