Abstract: Embodiments of RF amplifiers and RF amplifier devices include a transistor, a multiple-section bandpass filter circuit, and a harmonic termination circuit. The bandpass filter circuit includes a first connection node coupled to the amplifier input, a first inductive element coupled between the first connection node and a ground reference node, a first capacitance coupled between the first connection node and a second connection node, a second capacitance coupled between the second connection node and the ground reference node, and a second inductive element coupled between the second connection node and the transistor input. The harmonic termination circuit includes a third inductive element and a third capacitance connected in series between the transistor input and the ground reference node. The harmonic termination circuit resonates at a harmonic frequency of a fundamental frequency of operation of the RF amplifier.

Abstract: The embodiments described herein provide radio frequency (RF) amplifiers, and in some embodiments provide amplifiers that can be used in high power RF applications. Specifically, the amplifiers described herein may be implemented with multiple resonant circuits to provide class F and inverse class F amplifiers and methods of operation. In general, the resonant circuits are implemented inside a device package with a transistor die to provide high efficiency amplification for a variety of applications.

Abstract: The embodiments described herein provide radio frequency (RF) amplifiers, and in some embodiments provide amplifiers that can be used in high power RF applications. Specifically, the amplifiers described herein may be implemented with multiple resonant circuits to provide class F and inverse class F amplifiers and methods of operation. In general, the resonant circuits are implemented inside a device package with a transistor die to provide high efficiency amplification for a variety of applications.

Abstract: A seating assembly for a vehicle comprising: a cushion comprising an outer edge and a plurality of lines; a carrier comprising a perimeter outer surface and a plurality of line detents near the perimeter outer surface of the carrier retaining the plurality of lines such that the cushion is interconnected with the carrier; wherein the plurality of lines and plurality of line detents are arranged to prevent the edge of the cushion from rolling up. The cushion can further comprise a rearward extending lip having an inwardly facing surface; wherein the cushion at least partially surrounds the carrier with at least a portion of the inwardly facing surface of the lip facing the perimeter outer surface of the carrier.

Abstract: A seating system comprises a plurality of seating assemblies having first and second-row seating assemblies. Each seating assembly includes a cradle pivotally coupled to a seat base and to a seatback. The seat base is movable between first and second positions. The seating assembly includes a base having first and second supports and a swivel plate assembly including first and second frames. The first frame is coupled to the cradle, and the second frame is coupled to the base. The swivel plate assembly includes first and second swivel plates, the first swivel plate coupled to the first frame and the second swivel plate coupled to the second frame. The first swivel plate is configured to allow the cradle to rotate between first and second positions relative to the base. The seating system includes a track assembly. The first and second supports of the base are slidably coupled to the track assembly.

Abstract: Power amplifiers such as multi-path power amplifiers, systems employing such amplifiers, and methods of implementing amplifiers and amplifier systems are disclosed herein. In one example embodiment, a multi-path power amplifier includes a first semiconductor die with an integrated first transistor having a first source-to-drain pitch, and a second semiconductor die with an integrated second transistor having a second source-to-drain pitch, where the second source-to-drain pitch is smaller than the first source-to-drain pitch by at least 30 percent. In another example embodiment, a Doherty amplifier system includes a first semiconductor die with a first physical die area to total gate periphery ratio, and a second semiconductor die with a second physical die area to total gate periphery ratio, where the second physical die area to total gate periphery ratio is smaller than the first physical die area to total gate periphery ratio by at least 30 percent.

Abstract: A method of making a cushion assembly includes forming a first foam pad with a plurality of air cooling columns through the first foam pad. The plurality of air cooling columns terminate at a topper pad. A second foam pad is operably coupled with the first foam pad to define a non-linear flow channel between the first foam pad and the second foam pad. The non-linear flow channel is in fluid communication with the air cooling columns. An air mover is operably coupled to the non-linear flow channel to move air within the air cooling columns.

Abstract: A seating assembly for a vehicle includes a seat base pivotally and slidably coupled with a seatback and a support frame operable between a deployed position and a collapsed position. The support frame includes a first member that is pivotally coupled with a bottom portion of the seat base and pivotally coupled to a lower frame member fixedly attached to a floor support and a second member that is slidably coupled with a bottom portion of the seat base, pivotally coupled with the first member, and slidably coupled with the floor support. The support frame also includes a kickstand pivotally coupled to the floor support and slidably coupled to the seat base. The kickstand is operable between a forward position and a rearward position, wherein the kickstand is biased to and lockable in the forward position.

Abstract: Embodiments of RF amplifiers and packaged RF amplifier devices each include a transistor with a drain-source capacitance that is relatively low, an input impedance matching circuit, and an input-side harmonic termination circuit. The input impedance matching circuit includes a harmonic termination circuit, which in turn includes a first inductance (a first plurality of bondwires) and a first capacitance coupled in series between the transistor output and a ground reference node. The input impedance matching circuit also includes a second inductance (a second plurality of bondwires), a third inductance (a third plurality of bondwires), and a second capacitance coupled in a T-match configuration between the input lead and the transistor input. The first and second capacitances may be metal-insulator-metal capacitors in an integrated passive device.

Abstract: A seating assembly for a vehicle comprises: a cushion comprising an outer edge and a plurality of snap-fit-fasteners; and a carrier comprising an outer edge surface and a plurality of snap-fit receivers near the outer edge surface of the carrier arranged to receive the plurality of snap-fit fasteners; wherein the plurality of snap-fit receivers have received and are retaining the plurality of snap-fit fasteners such that the cushion is interconnected with the carrier; and wherein the plurality of snap-fit fasteners and plurality of receivers are arranged to prevent the edge of the cushion from rolling up. The cushion further comprises a lip having an inward facing surface; wherein the cushion at least partially surrounds the carrier with at least a portion of the inward facing surface of the lip facing the outer edge surface of the carrier.

Abstract: Power amplifiers such as multi-path power amplifiers, systems employing such amplifiers, and methods of implementing amplifiers and amplifier systems are disclosed herein. In one example embodiment, a multi-path power amplifier includes a first semiconductor die with an integrated first transistor having a first source-to-drain pitch, and a second semiconductor die with an integrated second transistor having a second source-to-drain pitch, where the second source-to-drain pitch is smaller than the first source-to-drain pitch by at least 30 percent. In another example embodiment, a Doherty amplifier system includes a first semiconductor die with a first physical die area to total gate periphery ratio, and a second semiconductor die with a second physical die area to total gate periphery ratio, where the second physical die area to total gate periphery ratio is smaller than the first physical die area to total gate periphery ratio by at least 30 percent.

Abstract: A work surface is provided with a lock assembly. The lock assembly includes an actuator plate and a locking plate. The actuator plate includes a pin. The locking plate includes an angled slot that receives the pin of the actuator plate. Actuation of the actuator plate in a first direction causes the pin to move within the angled slot of the locking plate. The movement of the pin within the angled slot causes movement of the locking plate in a second direction, thereby actuating the locking plate between a locked configuration and an unlocked configuration.

Abstract: A lifter mechanism for an edge of a seat cushion includes a bracket pivotable about a transverse bar. The bracket includes a forward lever and a rearward portion. The forward lever is coupled to a channel within a flange of a seat suspension. The rearward portion is coupled to a linkage. The linkage is coupled to a seatback. The forward lever raises an edge of the seat suspension upon the seatback pivoting to a predetermined reclined position.

Abstract: A lifter mechanism for an edge of a seat cushion includes a bracket detachable from and rotatable about a transverse bar. The bracket includes a forward lever and a rearward portion. The forward lever is coupled to a seat suspension. The rearward portion is coupled to a linkage. The linkage is coupled to a seatback. The forward lever raises an edge of the seat suspension upon the seatback pivoting to a predetermined reclined position.

Abstract: A vehicle seating assembly includes a seating surface and a tube arranged proximate the seating surface. The tube has an inlet fluidly coupled with a fluid mover and an outlet proximate the seating surface. A thermoelectric device is in communication with the outlet. The thermoelectric device is configured to thermodynamically affect heat exchange at the seating surface. The fluid mover is selectively operable to release a pressurized fluid through the tube proximate the thermoelectric device.

Abstract: Embodiments of RF amplifiers and packaged RF amplifier devices each include a transistor with a drain-source capacitance that is relatively low, an input impedance matching circuit, and an input-side harmonic termination circuit. The input impedance matching circuit includes a harmonic termination circuit, which in turn includes a first inductance (a first plurality of bondwires) and a first capacitance coupled in series between the transistor output and a ground reference node. The input impedance matching circuit also includes a second inductance (a second plurality of bondwires), a third inductance (a third plurality of bondwires), and a second capacitance coupled in a T-match configuration between the input lead and the transistor input. The first and second capacitances may be metal-insulator-metal capacitors in an integrated passive device.

Abstract: Embodiments of RF amplifiers and packaged RF amplifier devices each include a transistor with a drain-source capacitance that is relatively low, an output impedance matching circuit, and a harmonic termination circuit. The impedance matching circuit includes a harmonic termination circuit, which includes a first inductance (a first plurality of bondwires) and a first capacitance coupled in series between the transistor output and a ground reference node. An equivalent capacitance from a combination of the first inductive element and the first capacitance in series effectively increases the drain-source capacitance by at least 10 percent. The impedance matching circuit also includes a second inductance (a second plurality of bondwires) and a second capacitance coupled in series between the transistor output and the ground reference node, where the second inductance and the second capacitance are directly connected.

Abstract: A seat cushion assembly includes a first foam pad defining at least one air cooling column disposed therethrough. A topper pad is disposed over the first foam pad and the at least one air cooling column. A second foam pad is disposed below the first foam pad. The second foam pad and the first foam pad define a flow channel in fluid communication with the at least one air cooling column. An air mover moves air from an air intake of the flow channel to an air exhaust of the flow channel.

Abstract: A seating assembly for a vehicle comprises: a cushion comprising an outer edge and a plurality of snap-fit-fasteners; and a carrier comprising an outer edge surface and a plurality of snap-fit receivers near the outer edge surface of the carrier arranged to receive the plurality of snap-fit fasteners; wherein the plurality of snap-fit receivers have received and are retaining the plurality of snap-fit fasteners such that the cushion is interconnected with the carrier; and wherein the plurality of snap-fit fasteners and plurality of receivers are arranged to prevent the edge of the cushion from rolling up. The cushion further comprises a lip having an inward facing surface; wherein the cushion at least partially surrounds the carrier with at least a portion of the inward facing surface of the lip facing the outer edge surface of the carrier.

Abstract: A work surface for a vehicle includes an actuator plate that engages with a locking plate. Actuation of the actuator plate in a first direction induces actuation of the locking plate in a second direction, thereby actuating the locking plate between a locked and an unlocked configuration.