Abstract: A heat dissipating structure of an interface card is applied in an electronic device. The structure includes a heat dissipating apparatus attached to a circuit board of the electronic device, wherein the heat dissipating apparatus comprises a heat sink and a fan received in a room of the heat sink; and an interface card electrically connected to the circuit board of the electronic device via a connector. At least a surface of the interface card that is mounted with semiconductor components is mounted on top of a part of the heat dissipating apparatus in a faced-down manner to dissipate heat generated during operations of the semiconductor components to an external environment through the heat sink and the fan.

Abstract: An electronic circuit structure uses an analog-to-digital conversion concept for saving circuit pins and installs a control circuit on a main board, and the control circuit includes a processor, an analog-to-digital converter circuit, a power supply circuit and an ID generator circuit; wherein the power supply circuit is connected separately to the processor, the analog-to-digital converter circuit, and the ID generator circuit for providing a stable operating power supply; the analog-to-digital converter circuit is connected to the ID generator circuit for receiving a voltage divide power produced by the ID generator circuit and converting the voltage divide power into a digital machine ID; and the analog-to-digital converter circuit is connected to the processor for sending the machine ID. After the processor obtains the machine ID, the processor can analyze and determine the hardware configuration represented by the voltage divide power for the main board to carry out the booting operation.

Abstract: A heat dissipating structure of an interface card is applied in an electronic device. The structure includes a heat dissipating apparatus attached to a circuit board of the electronic device, wherein the heat dissipating apparatus comprises a heat sink and a fan received in a room of the heat sink; and an interface card electrically connected to the circuit board of the electronic device via a connector. At least a surface of the interface card that is mounted with semiconductor components is mounted on top of a part of the heat dissipating apparatus in a faced-down manner to dissipate heat generated during operations of the semiconductor components to an external environment through the heat sink and the fan.

Abstract: A method of preventing flash between solder pads on a circuit board is proposed. The method involves the step of forming a solder resistant structure on a area between at least two solder pads on the circuit board, such that the solder masks isolates the solder material that flashes between the solder pads, so as to prevent the solder material from flashing adjacent solder pads, thereby eliminating the occurrence of short circuiting.

Abstract: A method for preventing pins of a semiconductor package from short circuit during soldering is provided. The pins are soldered to a circuit board. At least one solder-mask area is formed on the circuit board or the pins, with a solder mask material being disposed on the solder-mask area. When the pins are soldered to the circuit board via a solder material, the solder material flashing to the solder-mask area is prevented to cause electrical connection between the adjacent pins, thereby preventing the pins from short circuit due to solder flash during the soldering process.

Abstract: A modularized electronic device coupling architecture and method is proposed, which is designed for the coupling of a first modularized electronic device with a second modularized electronic device, such as a tablet computer to a keyboard/touchpad base, so as to allow the tablet computer to use the data input capability provided by the keyboard/touchpad base and additionally allow the tablet computer have collapsible, rotatable, and dismountable capabilities, and also allows the user to dismount the tablet computer from the keyboard/touchpad base effortlessly by hand and use the tablet computer as an independent functional unit.

Abstract: A heat dissipating structure of a webpad is proposed, in which the webpad is formed with an air inlet, an air outlet, and a guiding tube that passes through a central processing unit and interconnects the air inlet and air outlet, with at least a heat dissipating device provided at a docking station of the webpad. When the webpad is connected to the docking station for high-speed operation, air from the heat dissipating device can pass through the air inlet and guiding tube to the central processing unit, and air taken with heat of the central processing unit is outputted through the air outlet to the atmosphere for effectively dissipating the heat generated by the central processing unit, so as to prevent the central processing unit from being damaged by overheat.