Patents by Inventor Spring Wu

Spring Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for overmolding of decorated plastic parts
    Patent number: 8552292
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Jeff Qin, Charles R. Hill, Suriaprakash Narotamo, Levin Li, Spring Wu, Zhong Wang
  • MULTIFUNCTIONAL THERMO-VACUUM-AIR PRESSURIZED FORMING MACHINE
    Publication number: 20130255877
    Abstract: Systems and methods of applying a decorating film to a substrate that reduce the occurrence of wrinkling of the decorating film during application of the film to the substrate and ensure a more uniform transfer of a pattern or image on the decorating film to the substrate. The same systems and methods can be used to apply a decorating film that laminates to a substrate. Systems of and methods for cooling a decorating chamber and removing the used decorating film from the substrate after a transfer of an image or pattern from the decorating film to the substrate.
    Type: Application
    Filed: February 7, 2013
    Publication date: October 3, 2013
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Spring Wu, Banghong Hu, Oliver Ren, Charles Raymon Hill
  • System and method for overmolding of decorated plastic parts
    Publication number: 20110180294
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Application
    Filed: December 13, 2010
    Publication date: July 28, 2011
    Inventors: Jichen (Jeff) Qin, Charles R. Hill, Suriaprakash Narotamo, Wu Bing (Levin) Li, Spring Wu, Zhong Wang