Patents by Inventor Sreejith Valiavalappil

Sreejith Valiavalappil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150225636
    Abstract: A polymer composition is taught and claimed, the composition comprising polymer, boron nitride and magnesium silicate, wherein the composition has certain thermal conductivity and dielectric properties. Additionally, the composition may be injection moldable.
    Type: Application
    Filed: April 24, 2015
    Publication date: August 13, 2015
    Inventors: Manjunatha Hosahalli Ramachandraiah, Sreejith Valiavalappil, Chitradurga L. Rao Aravinda, Srinivasan Duraiswamy
  • Publication number: 20130133942
    Abstract: Disclosed herein are example embodiments of electromagnetic interference (EMI) shields and method of making EMI shields. In an exemplary embodiment, a method generally includes coating at least part of a core member with metallic material, and coating at least part of the metallic material with a polymer to thereby inhibit separation of the metallic material from the core member. An example EMI shield generally includes a core member, a metallic coating covering at least part of the core member, and a polymeric coating covering at least part of the metallic coating to inhibit separation of the metallic coating from the core member.
    Type: Application
    Filed: January 25, 2013
    Publication date: May 30, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Shalini Kandoor, Bambore Lokeshwarappa Santhosh Kumar, Sreejith Valiavalappil, Bukkinakere Kapanipathaiya Chandrasekhar
  • Publication number: 20120153239
    Abstract: Electrically conductive compositions and composites, and methods of making the same are disclosed herein. An exemplary electrically conductive composite includes a polymer and a filler comprising a porous particle at least partially coated with metal. Additional fillers may be added, including metal particles such as acicular copper. Also disclosed are articles including the polymers and fillers and methods for their manufacture, where such articles may include an interconnect, circuit board, semiconductor, radio frequency identification tag, printed circuit, flexible circuit, tape, film, adhesive, gasket, sealant, ink, or paste.
    Type: Application
    Filed: February 16, 2012
    Publication date: June 21, 2012
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Bukkinakere Kapanipathaiya Chandrasekhar, Manjunatha Hosahalli Ramachandraiah, Padma Priya Sudarshana, Sreejith Valiavalappil