Patents by Inventor Sreekant Venkat Jagannath NARUMANCHI

Sreekant Venkat Jagannath NARUMANCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Jet impingement manifolds for cooling power electronics modules
    Patent number: 11751365
    Abstract: The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: September 5, 2023
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Gilberto Moreno, Sreekant Venkat Jagannath Narumanchi, Kevin Scott Bennion, Ramchandra Mahendrabhai Kotecha, Paul Philip Paret, Xuhui Feng
  • COOLING AUTOMOTIVE POWER ELECTRONICS
    Publication number: 20220225546
    Abstract: The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 14, 2022
    Inventors: Gilberto MORENO, Sreekant Venkat Jagannath NARUMANCHI, Xuhui FENG, Ammar OSMAN, Steve Michael MYERS, Brian James Kelly, Paul Philip Paret
  • JET IMPINGEMENT MANIFOLDS FOR COOLING POWER ELECTRONICS MODULES
    Publication number: 20210212242
    Abstract: The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.
    Type: Application
    Filed: October 29, 2020
    Publication date: July 8, 2021
    Inventors: Gilberto MORENO, Sreekant Venkat Jagannath NARUMANCHI, Kevin Scott BENNION, Ramchandra Mahendrabhai KOTECHA, Paul Philip PARET, Xuhui FENG
  • ELECTRONICS PACKAGING USING ORGANIC ELECTRICALLY INSULATING LAYERS
    Publication number: 20200181407
    Abstract: Disclosed herein are power electronics modules that include a polyimide film. For example, the power electronics modules described herein utilize polyimide film as a substrate and are capable of three-dimensional (3D) heat removal of semiconductors.
    Type: Application
    Filed: December 9, 2019
    Publication date: June 11, 2020
    Inventors: Douglas John DeVOTO, Joshua John MAJOR, Kevin Scott BENNION, Sreekant Venkat Jagannath NARUMANCHI, Paul Philip PARET, Gilberto MORENO, Justine Emily COUSINEAU