Patents by Inventor Sreeni Kurup

Sreeni Kurup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11834565
    Abstract: A method for producing a heat-shrinkable product is provided. First, a polymer composition containing a polymer, a crosslinking agent and a micro-encapsulated foaming agent uniformly dispensed therein is melt mixed. The foaming agent has a peak activation temperature which is higher than a temperature of the melt mixing. Next, the polymer composition is injection molded into a molded product. This carried out at the peak activation temperature to activate the foaming agent. Then, the molded product is crosslinked within the mold.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: December 5, 2023
    Assignee: Tyco Electronics UK Ltd.
    Inventor: Sreeni Kurup
  • Publication number: 20220220295
    Abstract: A cross-linkable composition includes an elastomeric fluoropolymer and a semi-crystalline fluoroplastic. The composition enables manufacturing of articles which maintain favorable mechanical properties (e.g. tensile strength, elongation and flexibility) when continuously exposed to extreme temperatures. In addition, a cross-linked product obtained by subjecting said composition to ionizing radiation is disclosed, which may be used in heat-shrinkable articles, cable jackets and sealing elements.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 14, 2022
    Applicant: Tyco Electronics UK LTD
    Inventors: Sreeni Kurup, Tiago Correia, Graham Wilkins
  • Publication number: 20220025148
    Abstract: A method for producing a heat-shrinkable product is provided. First, a polymer composition containing a polymer, a crosslinking agent and a micro-encapsulated foaming agent uniformly dispensed therein is melt mixed. The foaming agent has a peak activation temperature which is higher than a temperature of the melt mixing. Next, the polymer composition is injection molded into a molded product. This carried out at the peak activation temperature to activate the foaming agent. Then, the molded product is crosslinked within the mold.
    Type: Application
    Filed: October 5, 2021
    Publication date: January 27, 2022
    Applicant: Tyco Electronics UK Ltd.
    Inventor: Sreeni Kurup
  • Patent number: 10035910
    Abstract: A polymer composition is disclosed. The polymer composition comprises 30 to 40% by weight of a polyester-based thermoplastic elastomer, 15 to 25% by weight of an ethylene acrylic elastomer, and an organic phosphorus-based flame retardant comprising a metal salt of a dialkyl phosphinate.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: July 31, 2018
    Assignee: Tyco Electronics UK Ltd
    Inventor: Sreeni Kurup
  • Publication number: 20170073514
    Abstract: A polymer composition is disclosed. The polymer composition comprises 30 to 40% by weight of a polyester-based thermoplastic elastomer, 15 to 25% by weight of an ethylene acrylic elastomer, and an organic phosphorus-based flame retardant comprising a metal salt of a dialkyl phosphinate.
    Type: Application
    Filed: November 28, 2016
    Publication date: March 16, 2017
    Applicant: Tyco Electronics UK Ltd
    Inventor: Sreeni Kurup
  • Publication number: 20170009040
    Abstract: A method for producing a heat-shrinkable product is provided. First, a polymer composition containing a polymer, a crosslinking agent and a micro-encapsulated foaming agent uniformly dispensed therein is melt mixed. The foaming agent has a peak activation temperature which is higher than a temperature of the melt mixing. Next, the polymer composition is injection molded into a molded product. This carried out at the peak activation temperature to activate the foaming agent. Then, the molded product is crosslinked within the mold.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 12, 2017
    Applicant: Tyco Electronics UK Ltd.
    Inventor: Sreeni Kurup
  • Publication number: 20160300638
    Abstract: An article and process are described. The article includes a conductive heat-recoverable composite shield or a conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield. The conductive composite shield and/or the conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield comprises a non-conductive matrix and conductive particles within the non-conductive matrix. The article has a resistivity of less than 0.05 ohm·cm. A process of producing the conductive heat-recovered composite shield includes extruding the conductive heat-recoverable composite shield and heating the conductive heat-recoverable composite shield thereby forming the conductive heat-recovered composite shield.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 13, 2016
    Applicants: Tyco Electronics Corporation, Tyco Electronics UK Ltd.
    Inventors: Jialing Wang, Erling Hansen, Mark F. Wartenberg, Jennifer L. Robison, Sreeni Kurup, Richard B. Lloyd, Ting Gao