Patents by Inventor Sri M. Jayantha

Sri M. Jayantha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110049711
    Abstract: An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Applicant: International Business Machines Corporation
    Inventors: Sri M. Jayantha, Lorenzo Valdevit
  • Publication number: 20080217384
    Abstract: An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.
    Type: Application
    Filed: March 5, 2007
    Publication date: September 11, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sri M. Jayantha, Lorenzo Valdevit