Abstract: An organic substrate and method of making with optimal thermal warp characteristics is disclosed. The organic substrate has one or more top layers and one or more bottom layers. A chip footprint region is a surface region on each of the top and bottom layers that is defined as the projection of one or more semiconductor chips (chips) on the surface of each of the top and bottom layers. One or more top removal patterns are located on and may or may not remove material from the surface of one or more of the top layers within the chip footprint region of the respective top layer. One or more bottom removal patterns are located on and remove material from the surface of one or more of the bottom layers outside the chip footprint region of the respective bottom layer. The removal of the material from one or more of the top layers and/or bottom layers changes and optimizes a thermal warp of the organic substrate.

Abstract: An organic substrate and method of making with optimal thermal warp characteristics is disclosed. The organic substrate has one or more top layers and one or more bottom layers. A chip footprint region is a surface region on each of the top and bottom layers that is defined as the projection of one or more semiconductor chips (chips) on the surface of each of the top and bottom layers. One or more top removal patterns are located on and may or may not remove material from the surface of one or more of the top layers within the chip footprint region of the respective top layer. One or more bottom removal patterns are located on and remove material from the surface of one or more of the bottom layers outside the chip footprint region of the respective bottom layer. The removal of the material from one or more of the top layers and/or bottom layers changes and optimizes a thermal warp of the organic substrate.

Abstract: Method for detecting and reporting a condition. The components of the invention include an electronic package having a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.

Abstract: An invention for detecting and reporting a condition is described. The components of the invention comprise an electronic package comprising a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.

Abstract: An apparatus for detecting and reporting a condition is described. The apparatus is an electronic package comprising a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.

Abstract: A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.

Abstract: A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.

Abstract: A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.

Abstract: A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.

Abstract: A method of controlling an environmental condition within a building space having a plurality of devices sensitive to an environmental condition. The method includes the steps of: (a) sensing an environmental condition with plurality of monitors, each monitor having (i) a sensor to detect the environmental condition and generate a characteristic sensing signal and (ii) a transmitter to transmit a data signal in response to the sensing signal (b) transmitting the data signal from the plurality of sensors in response to the sensing signal; and (c) receiving and processing the data signal at a controller which controls a spatially fixed environmental modulator which, in response to the data signal, controls the environmental condition within the building space. A system for controlling an environmental condition within a building space having a Plurality of devices sensitive to an environmental condition is also provided.

Abstract: A method of optimizing a servo controller power required in the operation of two-dimensional flexure (Microelectronic Memory Storage) MEMS devices. Furthermore, provided is an arrangement for optimizing servo controller power in a two-dimensional flexure MEMS storage device through a utilization of the inventive method.

Abstract: A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

Abstract: A servo control system micro-electromechanical systems (MEMS)-based motion control system (and method therefor), includes a motion generator having an inherent stiffness component.

Abstract: Embodiments of the present invention pertain to method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, a flexure is formed that is capable of being coupled to an assembly joint. An assembly joint is formed so that the assembly joint is capable of being coupled to the flexure and the chassis of a computer system. A shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.

Abstract: A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.

Abstract: Embodiments of the present invention pertain to an apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, the disk drive shock absorber includes an assembly joint and a flexure. The flexure is capable of being coupled to the assembly joint. The assembly joint is capable of being coupled to the flexure and the computer system's chassis. The shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.

Abstract: A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.

Abstract: A MEMs-based system (and method), includes a sensor array including at least two sensors providing a basis for ensemble averaging.

Abstract: A servo control system micro-electromechanical systems (MEMS)-based motion control system (and method therefor), includes a motion generator having an inherent stiffness component.

Abstract: A method for settling on a target track of a servo system in a storage device (110) comprising a scanning probe (e.g., a scanning probe array system (124)) is disclosed, as well as a corresponding storage device (110). A data format is employed for the data stored in servo fields (18), consisting mainly of a preamble for assisting the settle process.