Patents by Inventor Sri Talpallikar

Sri Talpallikar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of applying thermal interface materials to board level shields
    Patent number: 10687447
    Abstract: Disclosed are exemplary embodiments of board level shields including thermal interface materials. Also disclosed are methods of applying thermal interface materials to board level shields.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: June 16, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Sri Talpallikar, Jason L. Strader
  • Thermal transfer/management and EMI shielding/mitigation solutions for electronic devices
    Patent number: 10446467
    Abstract: Disclosed are exemplary embodiments of thermal transfer/management and electromagnetic interference (EMI) shielding/mitigation solutions, systems, and/or assemblies for electronic devices. Also disclosed are methods of making or manufacturing (e.g., stamping, drawing, etc.) components of the thermal transfer/management and EMI shielding/mitigation solutions, systems, and/or assemblies.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: October 15, 2019
    Assignee: Laird Technologies, Inc.
    Inventor: Sri Talpallikar
  • Thermal Transfer/Management And EMI Shielding/Mitigation Solutions For Electronic Devices
    Publication number: 20190131206
    Abstract: Disclosed are exemplary embodiments of thermal transfer/management and electromagnetic interference (EMI) shielding/mitigation solutions, systems, and/or assemblies for electronic devices. Also disclosed are methods of making or manufacturing (e.g., stamping, drawing, etc.) components of the thermal transfer/management and EMI shielding/mitigation solutions, systems, and/or assemblies.
    Type: Application
    Filed: October 30, 2018
    Publication date: May 2, 2019
    Inventor: Sri TALPALLIKAR
  • BOARD LEVEL SHIELDS INCLUDING THERMAL INTERFACE MATERIALS AND METHODS OF APPLYING THERMAL INTERFACE MATERIALS TO BOARD LEVEL SHIELDS
    Publication number: 20180110158
    Abstract: Disclosed are exemplary embodiments of board level shields including thermal interface materials. Also disclosed are methods of applying thermal interface materials to board level shields.
    Type: Application
    Filed: October 13, 2017
    Publication date: April 19, 2018
    Inventors: Sri Talpallikar, Jason L. Strader
  • Selectively conductive EMI gaskets
    Patent number: 9226433
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: December 29, 2015
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Selectively Conductive EMI Gaskets
    Publication number: 20150090486
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Application
    Filed: November 10, 2014
    Publication date: April 2, 2015
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Selectively conductive EMI gaskets
    Patent number: 8884168
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 11, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly Cook, Thomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Selectively Conductive EMI Gaskets
    Publication number: 20140262471
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • EMI GASKETS WITH PERFORATIONS
    Publication number: 20140216806
    Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields, such as EMI gaskets. In an exemplary embodiment, the gasket includes a body of indefinite length. The gasket also includes a base with a generally flat outer surface, an upright portion extending generally upwardly away from the base, and a tail portion extending laterally away from the base. The base and the upright portion may intersect the tail portion at a fold line. One or more perforations and/or a crease may be along the fold line.
    Type: Application
    Filed: February 7, 2013
    Publication date: August 7, 2014
    Applicant: Laird Technologies, Inc
    Inventors: Michael Poulsen, Sri Talpallikar