Patents by Inventor Sri Thirunavukarasu

Sri Thirunavukarasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFER SINGULATION PROCESS
    Publication number: 20230187215
    Abstract: Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber. The electrostatic chuck includes a conductive pedestal having a plurality of notches at a circumferential edge thereof. The electrostatic chuck also includes a plurality of lift pins corresponding to ones of the plurality of notches.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Inventors: Sai Abhinand, Michael Sorensen, Karthik Elumalai, Dimantha Rajapaksa, Cheng Sun, James S. Papanu, Gaurav Mehta, Eng Sheng Peh, Sri Thirunavukarasu, Onkara Korasiddaramaiah
  • Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process
    Patent number: 11600492
    Abstract: Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber. The electrostatic chuck includes a conductive pedestal having a plurality of notches at a circumferential edge thereof. The electrostatic chuck also includes a plurality of lift pins corresponding to ones of the plurality of notches.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: March 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sai Abhinand, Michael Sorensen, Karthik Elumalai, Dimantha Rajapaksa, Cheng Sun, James S. Papanu, Gaurav Mehta, Eng Sheng Peh, Sri Thirunavukarasu, Onkara Korasiddaramaiah
  • ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFER SINGULATION PROCESS
    Publication number: 20210175086
    Abstract: Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber. The electrostatic chuck includes a conductive pedestal having a plurality of notches at a circumferential edge thereof. The electrostatic chuck also includes a plurality of lift pins corresponding to ones of the plurality of notches.
    Type: Application
    Filed: December 10, 2019
    Publication date: June 10, 2021
    Inventors: Sai Abhinand, Michael Sorensen, Karthik Elumalai, Dimantha Rajapaksa, Cheng Sun, James S. Papanu, Gaurav Mehta, Eng Sheng Peh, Sri Thirunavukarasu, Onkara Korasiddaramaiah