Abstract: Embodiments disclosed herein include devices to cool the walls of a mobile computing device. In one embodiment, a louvered vent is formed within an external wall of a mobile computing device to create an air curtain between the external wall and a heat generating component to cool the external wall. In another embodiment, a nozzle vent is formed within the external wall of a mobile computing device to flow cooling air at a heat generating component to cool the heat generating component.

Abstract: Embodiments disclosed herein include devices to cool the walls of a mobile computing device. In one embodiment, a louvered vent is formed within an external wall of a mobile computing device to create an air curtain between the external wall and a heat generating component to cool the external wall. In another embodiment, a nozzle vent is formed within the external wall of a mobile computing device to flow cooling air at a heat generating component to cool the heat generating component.

Abstract: Embodiments disclosed herein include devices to cool the walls of a mobile computing device. In one embodiment, a louvered vent is formed within an external wall of a mobile computing device to create an air curtain between the external wall and a heat generating component to cool the external wall. In another embodiment, a nozzle vent is formed within the external wall of a mobile computing device to flow cooling air at a heat generating component to cool the heat generating component.

Abstract: Embodiments disclosed herein include devices to cool the walls of a mobile computing device. In one embodiment, a louvered vent is formed within an external wall of a mobile computing device to create an air curtain between the external wall and a heat generating component to cool the external wall. In another embodiment, a nozzle vent is formed within the external wall of a mobile computing device to flow cooling air at a heat generating component to cool the heat generating component.

Abstract: Embodiments disclosed herein include devices to cool the walls of a mobile computing device. In one embodiment, a louvered vent is formed within an external wall of a mobile computing device to create an air curtain between the external wall and a heat generating component to cool the external wall. In another embodiment, a nozzle vent is formed within the external wall of a mobile computing device to flow cooling air at a heat generating component to cool the heat generating component.

Abstract: A method of creating a thermal influence table to describe thermal relationships between components in a system and use of the thermal influence table in a system is described. The thermal influence matrix may be generated dynamically for a system. The matrix may be used by a thermal management policy to enable a hot device to be cooled by power management of another device in the system.

Abstract: Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.

Abstract: According to some embodiments, systems for improved blower fans are provided. In some embodiments, systems may include a casing comprising an inlet to accept a fluid and an outlet to evacuate the fluid. The systems may further comprise an impeller disposed within the casing, comprising a hub and one or more impeller blades coupled to the hub. In some embodiments, the inlet of the casing may be shaped to reduce the amount of fluid that evacuates the casing via the inlet due to pressure within the casing.

Abstract: Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.

Abstract: Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device.

Abstract: An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.

Abstract: A fan assembly is described having a circular arrangement of fins located around a circular arrangement of blades. Air leaving tips of the blades has high velocity to efficiently break down a convection barrier layer on each of the fins. By breaking down the convection barrier layer, more heat is transferred from the fins to the air. An additional set of blades is located around the fins and an additional set of fins is located around the additional set of blades. Each fin is attached to a respective turn of a coiled heat pipe. The heat pipe has an end which is thermally connected to a processor of a computer.

Abstract: A system including a plurality of micro heat pipes is used to transfer heat from a die. A die attach block is coupled with the die. The plurality of micro heat pipes (MHPs) are attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die.

Abstract: A system including a plurality of micro heat pipes is used to transfer heat from a die. A die attach block is coupled with the die. The plurality of micro heat pipes (MHPs) are attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die.

Abstract: A fan assembly is described having a circular arrangement of fins located around a circular arrangement of blades. Air leaving tips of the blades has high velocity to efficiently break down a convection barrier layer on each of the fins. By breaking down the convection barrier layer, more heat is transferred from the fins to the air. An additional set of blades is located around the fins and an additional set of fins is located around the additional set of blades. Each fin is attached to a respective turn of a coiled heat pipe. The heat pipe has an end which is thermally connected to a processor of a computer.

Abstract: A system including a vapor chamber including a liquid. The vapor chamber is coupled with a die. The vapor chamber is attached to a plurality of micro pipes (MPs). When heat is generated by the die, the liquid is vaporized in the vapor chamber generating vapor. The vapor flows through the MPs to condensation ends of the MPs.