Patents by Inventor Sridharan Ranganathan
Sridharan Ranganathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9904650Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB3.0 system interface and an M-PHY interface, wherein the SSIC is configured to issue remote register access protocol (RRAP) commands through a local M-PHY to a remote M-PHY in a low speed burst mode.Type: GrantFiled: April 3, 2015Date of Patent: February 27, 2018Assignee: Intel CorporationInventors: Karthi R. Vadivelu, Sridharan Ranganathan, Anoop Mukker, Satheesh Chellappan
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Patent number: 9723431Abstract: A close proximity wireless connection is initiated between a first device and a second device, and a channel configuration module sends first data over the wireless connection to advertise one or more supported channel configurations of the first device to the second device, and receives second data over the wireless connection. The second data is to advertise one or more supported channel configurations of the second device to the first device. A particular one of a plurality of modes of the first device is determined to be used in communications with the second device over the close proximity wireless connection based on the first and second data.Type: GrantFiled: December 18, 2014Date of Patent: August 1, 2017Assignee: Intel CorporationInventor: Sridharan Ranganathan
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Patent number: 9697168Abstract: Techniques and mechanisms to provide common interface logic for multiple protocol engines to access physical layer circuitry at different times. In an embodiment, a state machine of an interface device is to participate in exchanges with physical layer resources on behalf of any of various protocol engines coupled to the interface device via different respective interfaces. Based on state transitions by the state machine, circuitry corresponding to a particular one of such interfaces may selectively send a clock signal for operation of a port controller attempting to access the physical layer circuitry. In some embodiments, multiple interface devices are configured to provide an hierarchical interface architecture for more than two port controllers that variously support at least two protocols.Type: GrantFiled: March 25, 2015Date of Patent: July 4, 2017Assignee: Intel CorporationInventors: Sridharan Ranganathan, Satheesh Chellappan
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Publication number: 20170176534Abstract: Logic controlling a local link interface enables in-band self-testing of the local link interface, the connected link interface of a remote device, and the link connecting the two. Logic configures a loopback in the remote device using an in-band protocol such as MIPI. The loopback may include all the link lanes or only a selected subset. The logic then isolates the local physical layer from upstream components and causes one or more test patterns to be sent through the local link interface and through the link to the loopback. The signals returning to the local link interface from the loopback are collected and compared with the original test patterns by an on-board checker in the link interface. The results, or a metric such as BER derived from the results, can then be accessed without requiring a custom dedicated test port.Type: ApplicationFiled: December 18, 2015Publication date: June 22, 2017Inventors: Satheesh Chellappan, Sridharan Ranganathan
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Patent number: 9552051Abstract: Disclosed herein is a system to minimize power leakage. The system is configured to include a system-on-chip (SOC). The SOC is configured to include a Universal Serial Bus (USB) physical subsystem and system firmware, wherein the system firmware conveys USB related events to the SOC. The system is configured to include a power management apparatus, where the power management apparatus includes USB wake functionality and USB On-the-Go (OTG) functionality.Type: GrantFiled: May 15, 2014Date of Patent: January 24, 2017Assignee: Intel CorporationInventors: Vinu K. Elias, Sridharan Ranganathan, Paul S. Durley
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Publication number: 20160283434Abstract: Techniques and mechanisms to provide common interface logic for multiple protocol engines to access physical layer circuitry at different times. In an embodiment, a state machine of an interface device is to participate in exchanges with physical layer resources on behalf of any of various protocol engines coupled to the interface device via different respective interfaces. Based on state transitions by the state machine, circuitry corresponding to a particular one of such interfaces may selectively send a clock signal for operation of a port controller attempting to access the physical layer circuitry. In some embodiments, multiple interface devices are configured to provide an hierarchical interface architecture for more than two port controllers that variously support at least two protocols.Type: ApplicationFiled: March 25, 2015Publication date: September 29, 2016Inventors: Sridharan Ranganathan, Satheesh Chellappan
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Patent number: 9405718Abstract: An interconnect architecture device of an aspect includes a processor to generate a transaction that is of a different interconnect protocol than LLI. The interconnect architecture device also includes conversion logic coupled with the processor. The conversion logic is to convert the transaction, which is of the different interconnect protocol than LLI, to an LLI packet. The interconnect architecture device also includes an LLI controller coupled with the conversion logic. The LLI controller is to couple the interconnect architecture device with an LLI link. The LLI controller is to transmit the LLI packet on the LLI link.Type: GrantFiled: February 28, 2013Date of Patent: August 2, 2016Assignee: Intel CorporationInventors: Sridharan Ranganathan, Mahesh Wagh
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Publication number: 20160183031Abstract: A close proximity wireless connection is initiated between a first device and a second device, and a channel configuration module sends first data over the wireless connection to advertise one or more supported channel configurations of the first device to the second device, and receives second data over the wireless connection. The second data is to advertise one or more supported channel configurations of the second device to the first device. A particular one of a plurality of modes of the first device is determined to be used in communications with the second device over the close proximity wireless connection based on the first and second data.Type: ApplicationFiled: December 18, 2014Publication date: June 23, 2016Inventor: Sridharan Ranganathan
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Patent number: 9280510Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.Type: GrantFiled: January 20, 2015Date of Patent: March 8, 2016Assignee: Intel CorporationInventors: Sridharan Ranganathan, David J. Harriman, Anoop Mukker, Satheesh Chellappan, Karthi R. Vadivelu, Shalini Sharma, Zeeshan Sarwar
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Publication number: 20150333735Abstract: Disclosed herein is a system to minimize power leakage. The system is configured to include a system-on-chip (SOC). The SOC is configured to include a Universal Serial Bus (USB) physical subsystem and system firmware, wherein the system firmware conveys USB related events to the SOC. The system is configured to include a power management apparatus, where the power management apparatus includes USB wake functionality and USB On-the-Go (OTG) functionality.Type: ApplicationFiled: May 15, 2014Publication date: November 19, 2015Inventors: VINU K. ELIAS, SRIDHARAN RANGANATHAN, PAUL S. DURLEY
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Publication number: 20150212969Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB3.0 system interface and an M-PHY interface, wherein the SSIC is configured to issue remote register access protocol (RRAP) commands through a local M-PHY to a remote M-PHY in a low speed burst mode.Type: ApplicationFiled: April 3, 2015Publication date: July 30, 2015Applicant: Intel CorporationInventors: Karthi R. Vadivelu, SRIDHARAN RANGANATHAN, ANOOP MUKKER, SATHEESH CHELLAPPAN
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Patent number: 9092367Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface, wherein the SSIC is configured to issue remote register access protocol (RRAP) commands through a local M-PHY to a remote M-PHY in a low speed burst mode.Type: GrantFiled: May 2, 2012Date of Patent: July 28, 2015Assignee: Intel CorporationInventors: Karthi R. Vadivelu, Sridharan Ranganathan, Anoop Mukker, Satheesh Chellappan
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Publication number: 20150134866Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.Type: ApplicationFiled: January 20, 2015Publication date: May 14, 2015Inventors: Sridharan Ranganathan, David J. Harriman, Anoop Mukker, Satheesh Chellappan, Karthi R. Vadivelu, Shalini Sharma, Zeeshan Sarwar
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Patent number: 9031064Abstract: In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.Type: GrantFiled: February 21, 2014Date of Patent: May 12, 2015Assignee: Intel CorporationInventors: Sridharan Ranganathan, Mahesh Wagh, David J. Harriman
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Patent number: 8972646Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.Type: GrantFiled: March 30, 2012Date of Patent: March 3, 2015Assignee: Intel CorporationInventors: Sridharan Ranganathan, David J. Harriman, Anoop Mukker, Satheesh Chellappan, Karthi R. Vadivelu, Shalini Sharma, Zeeshan Sarwar
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Publication number: 20140289434Abstract: An interconnect architecture device of an aspect includes a processor to generate a transaction that is of a different interconnect protocol than LLI. The interconnect architecture device also includes conversion logic coupled with the processor. The conversion logic is to convert the transaction, which is of the different interconnect protocol than LLI, to an LLI packet. The interconnect architecture device also includes an LLI controller coupled with the conversion logic. The LLI controller is to couple the interconnect architecture device with an LLI link. The LLI controller is to transmit the LLI packet on the LLI link.Type: ApplicationFiled: February 28, 2013Publication date: September 25, 2014Inventors: Sridharan Ranganathan, Mahesh Wagh
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Publication number: 20140173164Abstract: In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.Type: ApplicationFiled: February 21, 2014Publication date: June 19, 2014Inventors: Sridharan Ranganathan, Mahesh Wagh, David J. Harriman
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Patent number: 8737390Abstract: In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.Type: GrantFiled: April 25, 2013Date of Patent: May 27, 2014Assignee: Intel CorporationInventors: Sridharan Ranganathan, Mahesh Wagh, David J. Harriman
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Publication number: 20130318279Abstract: In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.Type: ApplicationFiled: April 25, 2013Publication date: November 28, 2013Inventors: Sridharan Ranganathan, Mahesh Wagh, David J. Harriman
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Publication number: 20130297833Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface, wherein the SSIC is configured to issue remote register access protocol (RRAP) commands through a local M-PHY to a remote M-PHY in a low speed burst mode.Type: ApplicationFiled: May 2, 2012Publication date: November 7, 2013Inventors: Karthi R. Vadivelu, Sridharan Ranganathan, Anoop Mukker, Satheesh Chellappan