Patents by Inventor Srikanth Bolnedi

Srikanth Bolnedi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6455419
    Abstract: An electronic device is provided that compromises a dielectric layer (12) disposed outwardly from a substrate (10). The dielectric layer (12) has at least one contact opening (14) formed through the dielectric layer (12). The device has an adhesion layer (16) disposed outwardly from the exposed surfaces of the dielectric layer (12) and the substrate (10). A first barrier layer (18) is formed outwardly from the adhesion layer (16). A second barrier layer (20) is formed outwardly from the first barrier layer (18). A conductive plug (24) fills the contact opening (14) and is disposed outwardly from the second barrier layer (20).
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: September 24, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Anthony J. Konecni, Srikanth Bolnedi
  • Patent number: 6215186
    Abstract: An electronic device is provided that compromises a dielectric layer (12) disposed outwardly from a substrate (10). The dielectric layer (12) has at least one contact opening (14) formed through the dielectric layer (12). The device has an adhesion layer (16) disposed outwardly from the exposed surfaces of the dielectric layer (12) and the substrate (10). A first barrier layer (18) is formed outwardly from the adhesion layer (16). A second barrier layer (20) is formed outwardly from the first barrier layer (18). A conductive plug (24) fills the contact opening (14) and is disposed outwardly from the second barrier layer (20).
    Type: Grant
    Filed: January 5, 1999
    Date of Patent: April 10, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Anthony J. Konecni, Srikanth Bolnedi