Patents by Inventor Srikanth Kamireddi
Srikanth Kamireddi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10691169Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.Type: GrantFiled: May 9, 2018Date of Patent: June 23, 2020Assignee: APPLE INC.Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dale N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
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Patent number: 10144107Abstract: Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.Type: GrantFiled: September 29, 2016Date of Patent: December 4, 2018Assignee: APPLE INC.Inventors: Srikanth Kamireddi, Alexander M. Hoffman
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Patent number: 10112278Abstract: A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.Type: GrantFiled: December 30, 2015Date of Patent: October 30, 2018Assignee: APPLE INC.Inventors: Palaniappan Chinnakaruppan, Srikanth Kamireddi
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Publication number: 20180284843Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.Type: ApplicationFiled: May 9, 2018Publication date: October 4, 2018Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dele N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
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Patent number: 10065289Abstract: A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.Type: GrantFiled: September 2, 2015Date of Patent: September 4, 2018Assignee: Apple Inc.Inventors: Palaniappan Chinnakaruppan, Srikanth Kamireddi
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Patent number: 9977464Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.Type: GrantFiled: August 26, 2015Date of Patent: May 22, 2018Assignee: APPLE INC.Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dale N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
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Publication number: 20170087683Abstract: A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.Type: ApplicationFiled: December 30, 2015Publication date: March 30, 2017Inventors: Palaniappan Chinnakaruppan, Srikanth Kamireddi
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Publication number: 20170087687Abstract: Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.Type: ApplicationFiled: September 29, 2016Publication date: March 30, 2017Inventors: Srikanth Kamireddi, Alexander M. Hoffman
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Publication number: 20160062405Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.Type: ApplicationFiled: August 26, 2015Publication date: March 3, 2016Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dale N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
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Publication number: 20160059383Abstract: A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.Type: ApplicationFiled: September 2, 2015Publication date: March 3, 2016Inventors: Palaniappan Chinnakaruppan, Srikanth Kamireddi
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Patent number: 9134260Abstract: The present invention consists of an x-ray goniometer which is positioned directly adjacent to processing machines used in the cutting, milling, drilling and shaping of crystal boules and crystal ingots, used in conjunction with an adjustable tilt platform capable of pitch, yaw and roll movement, to allow in-situ measurement and automatic adjustment of crystal orientation with respect to the processing machine. The goniometer may be secured to either the tool itself or a portion of the machine which is adjacent the piece to be worked. Various embodiments include an x-ray goniometer and adjustable tilt platform incorporated into a core drilling machine, wire saw, surface grinder, polishing apparatus, or orientation flat or notch grinder.Type: GrantFiled: December 8, 2014Date of Patent: September 15, 2015Assignee: Rubicon Technology, Inc.Inventor: Srikanth Kamireddi
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Publication number: 20150092920Abstract: The present invention consists of an x-ray goniometer which is positioned directly adjacent to processing machines used in the cutting, milling, drilling and shaping of crystal boules and crystal ingots, used in conjunction with an adjustable tilt platform capable of pitch, yaw and roll movement, to allow in-situ measurement and automatic adjustment of crystal orientation with respect to the processing machine. The goniometer may be secured to either the tool itself or a portion of the machine which is adjacent the piece to be worked. Various embodiments include an x-ray goniometer and adjustable tilt platform incorporated into a core drilling machine, wire saw, surface grinder, polishing apparatus, or orientation flat or notch grinder.Type: ApplicationFiled: December 8, 2014Publication date: April 2, 2015Applicant: Rubicon Technology, Inc.Inventor: Srikanth KAMIREDDI
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Patent number: 8934606Abstract: The invention includes an x-ray goniometer positionable directly adjacent to processing machines used in the cutting, milling, drilling and shaping of crystal boules and crystal ingots, used in conjunction with an adjustable tilt platform capable of pitch, yaw and roll movement, allowing in-situ measurement and automatic adjustment of crystal orientation with respect to the processing machine. The goniometer may be secured to the tool or a portion of the machine which is adjacent the piece to be worked. Various embodiments include an x-ray goniometer and adjustable tilt platform incorporated into a core drilling machine, saw, surface grinder, polishing apparatus, or orientation flat or notch grinder. Incorporating an x-ray goniometer and adjustable tilt platform directly into a crystal processing machine results in a decrease in overall processing time and labor, and a significant increase in precision when processing crystal ingots into a final product, such as a notched wafer.Type: GrantFiled: August 2, 2012Date of Patent: January 13, 2015Assignee: Rubicon Technology, Inc.Inventor: Srikanth Kamireddi
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Publication number: 20130028385Abstract: The invention includes an x-ray goniometer positionable directly adjacent to processing machines used in the cutting, milling, drilling and shaping of crystal boules and crystal ingots, used in conjunction with an adjustable tilt platform capable of pitch, yaw and roll movement, allowing in-situ measurement and automatic adjustment of crystal orientation with respect to the processing machine. The goniometer may be secured to the tool or a portion of the machine which is adjacent the piece to be worked. Various embodiments include an x-ray goniometer and adjustable tilt platform incorporated into a core drilling machine, saw, surface grinder, polishing apparatus, or orientation flat or notch grinder. Incorporating an x-ray goniometer and adjustable tilt platform directly into a crystal processing machine results in a decrease in overall processing time and labor, and a significant increase in precision when processing crystal ingots into a final product, such as a notched wafer.Type: ApplicationFiled: August 2, 2012Publication date: January 31, 2013Applicant: RUBICON TECHNOLOGY, INC.Inventor: Srikanth KAMIREDDI
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Patent number: 8259901Abstract: The present invention consists of an x-ray goniometer which is positioned directly adjacent to processing machines used in the cutting, milling, drilling and shaping of crystal boules and crystal ingots, used in conjunction with an adjustable tilt platform capable of pitch, yaw and roll movement, to allow in-situ measurement and automatic adjustment of crystal orientation with respect to the processing machine. The goniometer may be secured to either the tool itself or a portion of the machine which is adjacent the piece to be worked. Various embodiments include an x-ray goniometer and adjustable tilt platform incorporated into a core drilling machine, wire saw, surface grinder, polishing apparatus, or orientation flat or notch grinder.Type: GrantFiled: May 25, 2010Date of Patent: September 4, 2012Assignee: Rubicon Technology, Inc.Inventor: Srikanth Kamireddi