Patents by Inventor Srikanth Krishnamurthy

Srikanth Krishnamurthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12638098
    Abstract: Certain embodiments of the present disclosure relate to a fluid flow valve. The valve includes a housing configured to receive a flow of fluid. The valve further includes a diaphragm to actuate between a closed position and a plurality of open positions. The valve further includes a first valve portion configured to flow a first amount of fluid responsive to the diaphragm actuating to one or more first open positions of the plurality of open positions. The valve further includes a second valve portion in parallel with the first valve portion and configured to flow a second amount of fluid responsive to the diaphragm actuating to one or more second open positions of the plurality of open positions.
    Type: Grant
    Filed: September 25, 2023
    Date of Patent: May 26, 2026
    Assignee: Applied Materials, Inc.
    Inventor: Srikanth Krishnamurthy
  • Patent number: 12553752
    Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a housing having a first channel configured to flow a gas in a first direction and a second channel configured to flow the gas in a second direction. The housing is configured to couple to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region within the first channel, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. A sensor die is coupled to the inner region of the substrate, having an electrical connection to the electrical contact pads. The sensor die is disposed within a gas flow path of the first channel.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: February 17, 2026
    Assignee: Applied Materials, Inc.
    Inventors: Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada
  • Patent number: 12547741
    Abstract: An information handling system includes a BMC configurable in a first mode to provide external encryption keys for transactions with a storage device from external key management services, and in a second mode to generate local encryption keys for the transactions. At a first time, the BMC is configured in the first mode to provide external encryption keys for the transactions from a first external key management service. At a second time subsequent to the first time, the BMC is configured in the second mode to generate local encryption keys for the transactions. At a third time subsequent to the second time, the BMC is configured in the first mode to provide second external encryption keys for the transactions from a second external key management service. After the third time, no user data is lost on the first storage device as compared with a time prior to the first time.
    Type: Grant
    Filed: April 18, 2024
    Date of Patent: February 10, 2026
    Assignee: Dell Products L.P.
    Inventors: Marcelo Saraiva, Manjunath Vishwanath, Ajay Shenoy, Srikanth Krishnamurthy
  • Publication number: 20260036454
    Abstract: A sensor assembly includes a substrate including one or more electrical contact pads on at least an inner region of the substrate. The sensor assembly further includes a housing coupled to the substrate by a flange, the flange to provide a hermetic seal between the housing and the substrate. The housing is configured to be coupled to a fluid flow channel at a first end of the housing and at a second end of the housing. The sensor assembly further includes a sensor die coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via one or more alignment features.
    Type: Application
    Filed: October 8, 2025
    Publication date: February 5, 2026
    Inventors: Arvinder Manmohan Singh Chadha, Ashley M. Okada, Srikanth Krishnamurthy, Ming Xu
  • Patent number: 12492926
    Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: December 9, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Arvinder Manmohan Singh Chadha, Ashley M. Okada, Srikanth Krishnamurthy, Ming Xu
  • Publication number: 20250327695
    Abstract: A method includes opening a flow path from a gas stick through a variable orifice, a chamber, and an outlet isolation valve of the chamber. The method further includes causing a gas to flow through the flow path at a flow rate setpoint. The method further includes actuating an opening of the variable orifice to establish a choked pressure regime within the chamber, the choked pressure regime being achieved by causing a first pressure upstream of the variable orifice to be at least two times a second pressure downstream of the variable orifice. The method further includes closing the outlet isolation valve to cause the chamber to be filled with the gas from the gas stick. The method further includes measuring a pressure rate-of-rise within the chamber. The method further includes determining one or more flow measurements based at least in part on the pressure rate-of-rise.
    Type: Application
    Filed: April 15, 2025
    Publication date: October 23, 2025
    Inventors: Ashley Okada, Ming Xu, Srikanth Krishnamurthy, Andreas Johannes Jendrzey
  • Publication number: 20250328657
    Abstract: An information handling system includes a BMC configurable in a first mode to provide external encryption keys for transactions with a storage device from external key management services, and in a second mode to generate local encryption keys for the transactions. At a first time, the BMC is configured in the first mode to provide external encryption keys for the transactions from a first external key management service. At a second time subsequent to the first time, the BMC is configured in the second mode to generate local encryption keys for the transactions. At a third time subsequent to the second time, the BMC is configured in the first mode to provide second external encryption keys for the transactions from a second external key management service. After the third time, no user data is lost on the first storage device as compared with a time prior to the first time.
    Type: Application
    Filed: April 18, 2024
    Publication date: October 23, 2025
    Inventors: Marcelo Saraiva, Manjunath Vishwanath, Ajay Shenoy, Srikanth Krishnamurthy
  • Publication number: 20250102074
    Abstract: Certain embodiments of the present disclosure relate to a fluid flow valve. The valve includes a housing configured to receive a flow of fluid. The valve further includes a diaphragm to actuate between a closed position and a plurality of open positions. The valve further includes a first valve portion configured to flow a first amount of fluid responsive to the diaphragm actuating to one or more first open positions of the plurality of open positions. The valve further includes a second valve portion in parallel with the first valve portion and configured to flow a second amount of fluid responsive to the diaphragm actuating to one or more second open positions of the plurality of open positions.
    Type: Application
    Filed: September 25, 2023
    Publication date: March 27, 2025
    Inventor: Srikanth Krishnamurthy
  • Publication number: 20240369389
    Abstract: A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the outer region to provide a hermetic seal. The sensor assembly further includes a sensor device coupled to the substrate, via the electrical contact pads, at the inner region.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Inventors: Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada, Ramachandra Murthy Gunturi, Vijay Parkhe
  • Patent number: 12073228
    Abstract: A UEFI client initiates an SMB negotiation with a remote server for an augmented capability protocol that supports secure distributed namespace compounding via customized commands and trusted share-specific and transaction-specific data structures, referred to herein simply as secure blobs, communicated over a secure tunnel. The client platform may include a nonvolatile storage resource containing factory-installed AC modules for both the client and the server, as well as factory stored profile information for known remote shares. Upon successfully negotiating for the AC protocol, the UEFI client may retrieve and install the AC client and server modules to enable the AC protocol. The AC client may mount a local namespace, which includes a namespace folder for each remote share. The AC server module, in combination with remote share profile information provided by the AC client, enables the remote server to mount a virtual distributed namespace and function as a RVDN server.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: August 27, 2024
    Assignee: Dell Products L.P.
    Inventors: Shekar Babu Suryanarayana, Srikanth Krishnamurthy
  • Patent number: 12061103
    Abstract: Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: August 13, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada, Ramachandra Murthy Gunturi, Vijay Parkhe
  • Patent number: 11842228
    Abstract: Disclosed information handling systems and methods employ a background module running in an operating system of a client platform to evaluate, after defined context-relevant events including, as examples, reboot, application launch, return from sleep/idle mode, change of network connection, and change of device, the impact of the user context change, and to take or recommend appropriate action. Embodied solutions may augment existing communication protocols, such as the Server Message Block (SMB) protocol, that enable and support shared access to files across nodes of a distributed system.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: December 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Srikanth Krishnamurthy, Shekar Babu Suryanarayana
  • Publication number: 20230342227
    Abstract: Disclosed information handling systems and methods employ a background module running in an operating system of a client platform to evaluate, after defined context-relevant events including, as examples, reboot, application launch, return from sleep/idle mode, change of network connection, and change of device, the impact of the user context change, and to take or recommend appropriate action. Embodied solutions may augment existing communication protocols, such as the Server Message Block (SMB) protocol, that enable and support shared access to files across nodes of a distributed system.
    Type: Application
    Filed: April 22, 2022
    Publication date: October 26, 2023
    Applicant: Dell Products L.P.
    Inventors: Srikanth KRISHNAMURTHY, Shekar Babu SURYANARAYANA
  • Publication number: 20230313376
    Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a housing having a first channel configured to flow a gas in a first direction and a second channel configured to flow the gas in a second direction. The housing is configured to couple to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region within the first channel, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. A sensor die is coupled to the inner region of the substrate, having an electrical connection to the electrical contact pads. The sensor die is disposed within a gas flow path of the first channel.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 5, 2023
    Inventors: Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada
  • Publication number: 20230314197
    Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 5, 2023
    Inventors: Arvinder Manmohan Singh Chadha, Ashley M. Okada, Srikanth Krishnamurthy, Ming Xu
  • Publication number: 20230029401
    Abstract: A UEFI client initiates an SMB negotiation with a remote server for an augmented capability protocol that supports secure distributed namespace compounding via customized commands and trusted share-specific and transaction-specific data structures, referred to herein simply as secure blobs, communicated over a secure tunnel. The client platform may include a nonvolatile storage resource containing factory-installed AC modules for both the client and the server, as well as factory stored profile information for known remote shares. Upon successfully negotiating for the AC protocol, the UEFI client may retrieve and install the AC client and server modules to enable the AC protocol. The AC client may mount a local namespace, which includes a namespace folder for each remote share. The AC server module, in combination with remote share profile information provided by the AC client, enables the remote server to mount a virtual distributed namespace and function as a RVDN server.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 26, 2023
    Applicant: Dell Products L.P.
    Inventors: Shekar Babu SURYANARAYANA, Srikanth KRISHNAMURTHY
  • Publication number: 20220357187
    Abstract: Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.
    Type: Application
    Filed: May 10, 2021
    Publication date: November 10, 2022
    Inventors: Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada, Ramachandra Murthy Gunturi, Vijay Parkhe
  • Patent number: 11334419
    Abstract: A disclosed fault analysis solution and method includes provisioning an NVMe boot directory of an information handling system with a notification module configured to perform certain operations in a pre-OS context, The operations may include detecting a pre-OS error event, determining a faulty component associated with the error event, identifying one or more executable scripts and tools associated with the faulty component, invoking a support app to download the one or more executable scripts and tools, and executing the one or more executable scripts and tools to generate a fault analysis report. The executable scripts may perform script operations including retrieving event data including one or more logs and system parameters associated with either the error event or the faulty component and storing the event data in an error log file. The executable tools may perform remedial measures associated with the error event or the faulty component.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: May 17, 2022
    Assignee: Dell Products L.P.
    Inventors: Shekar Babu Suryanarayana, Srikanth Krishnamurthy, Sumanth Vidyadhara
  • Patent number: 7668127
    Abstract: The present invention relates to power management within the context of wireless ad-hoc networks. More specifically to the effects of using different transmit powers on the average power consumption and end-to-end network throughput in a wireless ad-hoc environment. This power management approach reduces the system power consumption and thereby prolongs the battery life of mobile nodes. Furthermore, the invention improves the end-to-end network throughput as compared to other ad-hoc networks in which all mobile nodes use the same transmit power. The improvement is due to the achievement of a tradeoff between minimizing interference ranges, reduction in the average number of hops to reach a destination, reducing the probability of having isolated clusters, and reducing the average number of transmissions including retransmissions due to collisions. The present invention provides a network with enhanced end-to-end throughput performance, and lower transmit power.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: February 23, 2010
    Assignee: HRL Laboratories, LLC
    Inventors: Srikanth Krishnamurthy, Tamer ElBatt, Dennis Connors
  • Publication number: 20080132264
    Abstract: The present invention relates to power management within the context of wireless ad-hoc networks. More specifically to the effects of using different transmit powers on the average power consumption and end-to-end network throughput in a wireless ad-hoc environment. This power management approach reduces the system power consumption and thereby prolongs the battery life of mobile nodes. Furthermore, the invention improves the end-to-end network throughput as compared to other ad-hoc networks in which all mobile nodes use the same transmit power. The improvement is due to the achievement of a tradeoff between minimizing interference ranges, reduction in the average number of hops to reach a destination, reducing the probability of having isolated clusters, and reducing the average number of transmissions including retransmissions due to collisions. The present invention provides a network with enhanced end-to-end throughput performance, and lower transmit power.
    Type: Application
    Filed: April 1, 2004
    Publication date: June 5, 2008
    Inventors: Srikanth Krishnamurthy, Tamer ElBatt, Dennis Connors