Patents by Inventor Srikanth Miryala

Srikanth Miryala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7579068
    Abstract: A structural member is reinforced with a thermoset polymer foam having (a) a density of 80-650 kg/m3, (b) a storage modulus, measured on a 12 mm wide×3.5 mm thick×17.5 single cantilever sample according to ASTM D 4065-01, under conditions of 1 Hz and a heating rate of 2° C./min, such that the ratio of the storage modulus at 0° C., expressed in MPa, divided by the density of the thermoset polymer foam, expressed in kg/m3, is at least 0.4, and (c) the ratio of the storage modulus of the thermoset polymer foam at 100° C. divided by the storage modulus of the thermoset polymer foam at 0° C. is at least 0.5. The foam is preferably a polyurethane-isocyanurate foam. The foam exhibits excellent resistance to cracking due to mechanical and thermal stresses.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: August 25, 2009
    Assignee: Dow Global Technologies, Inc.
    Inventors: Mark P. Allen, Huzeir Lekovic, Srikanth Miryala, Arnold W. Braun, Jr.
  • Publication number: 20060222838
    Abstract: A structural member is reinforced with a thermoset polymer foam having (a) a density of 80-650 kg/m3, (b) a storage modulus, measured on a 12 mm wide×3.5 mm thick×17.5 single cantilever sample according to ASTM D 4065-01, under conditions of 1 Hz and a heating rate of 2° C./min, such that the ratio of the storage modulus at 0° C., expressed in MPa, divided by the density of the thermoset polymer foam, expressed in kg/m3, is at least 0.4, and (c) the ratio of the storage modulus of the thermoset polymer foam at 100° C. divided by the storage modulus of the thermoset polymer foam at 0° C. is at least 0.5. The foam is preferably a polyurethane-isocyanurate foam. The foam exhibits excellent resistance to cracking due to mechanical and thermal stresses.
    Type: Application
    Filed: November 10, 2005
    Publication date: October 5, 2006
    Inventors: Mark Allen, Huzeir Lekovic, Srikanth Miryala, Arnold Braun