Patents by Inventor Srikanth Narasimulau

Srikanth Narasimulau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold for encapsulating a semiconductor chip
    Patent number: 6860731
    Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: March 1, 2005
    Assignee: ASM Technology Singapore PTE Ltd.
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Srikanth Narasimulau, Murali Sarangapani
  • Mold for a semiconductor chip
    Patent number: 6674165
    Abstract: A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: January 6, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles J. Vath, III
  • Mold
    Publication number: 20030034555
    Abstract: A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.
    Type: Application
    Filed: August 15, 2001
    Publication date: February 20, 2003
    Applicant: ASM Technology Singapore Pte. Ltd.
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles J. Vath