Abstract: A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g.

Abstract: A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g.

Abstract: A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g.

Abstract: A semiconductor device and fabrication process includes forming a gate dielectric overlying a semiconductor substrate and a gate electrode overlying the gate dielectric. The gate electrode includes an interface between a first portion of the gate electrode and a second portion of the gate electrode. A silicide is then formed overlying the gate electrode. The presence of the gate electrode interface substantially prevents the silicide from spiking into or through the gate electrode to encroach upon or contact the underlying gate dielectric. Forming the gate electrode may include forming a polysilicon first gate electrode layer and forming an amorphous silicon layer over the polysilicon first gate electrode layer. Forming the second gate electrode layer may include forming a SiGe first sublayer and a polysilicon second sublayer.

Abstract: In one embodiment, metal boride (MBx), metal carbide (MCx), metal carbo-nitrides (MCxNy), metal boro-carbide (MBxCy), metal boro-nitride (MBxNy) or metal boro-carbo-nitride (MBxCyNz), wherein the metal is a transition metal (Group III-XII of the periodic chart) may be suitable as NMOS gate electrode materials. Such materials, such as TaC and LaB6, can be formed to have work functions that are within approximately 4-4.3 eV, which is desirable for NMOS transistors. In addition, the amount of carbon or nitrogen can be adjusting the amount of carbon or nitrogen in the precursor to achieve a predetermined metal work function.