Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: A load lock system including an imaging subsystem and an image processing subsystem to capture comprehensive data of a substrate within a load lock chamber. The imaging subsystem can include multiple imaging elements (e.g. cameras or image sensors), to capture image data of a substrate. The image processing subsystem can process the image data with a number of computer vision, or feature extraction techniques to identify nonconformities associated with the substrate. These nonconformities can include chips, breaks, scratch, placement errors, orientation errors, or a number of other errors associated with the substrate and substrate components. The image processing subsystem can further output a message indicating any one of these errors have occurred.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: An approach for securing a DHCP server against unauthorized client attacks in a SDN environment is presented. In an embodiment, a method comprises: determining a count of sub-interfaces implemented on an interface card of a virtual machine; setting a count of unique client identifiers for the virtual machine to zero; determining whether a dynamic host configuration protocol (DHCP) request has been received from the virtual machine; in response to determining that a DHCP request has been received from the virtual machine, incrementing the count of unique client identifiers; determining whether the count of unique client identifiers exceeds the count of sub-interfaces implemented on the interface card of the virtual machine; and in response to determining that the count of unique client identifiers does not exceed the count of sub-interfaces implemented on the interface card of the virtual machine, forwarding the DHCP request to an uplink port.

Abstract: The disclosure provides an approach for load balancing packets within a data center. The approach leverages dynamically collected and up-to-date health information on each virtual computing instance located within the data center. In one embodiment, health monitoring modules, located within hypervisors of each host computer, collect health statistics on local virtual computing instances. Each health monitoring module shares its locally collected health statistics with every other health monitoring module. Each health monitoring module provides the shared health statistics, on all virtual computing instances within the data center, to a local load balancing module located within the hypervisor of each host computer. Each load balancing module uses health statistics of all virtual computing instances to load balance packets within the data center.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). In one embodiment a process kit for use in an atomic layer deposition (ALD) chamber is disclosed and includes a dielectric window, a sealing frame, and a mask frame connected with the sealing frame, wherein the mask frame has a gas inlet channel and a gas outlet channel formed therein on opposing sides thereof.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: The disclosure provides an approach for load balancing packets within a data center. The approach leverages dynamically collected and up-to-date health information on each virtual computing instance located within the data center. In one embodiment, health monitoring modules, located within hypervisors of each host computer, collect health statistics on local virtual computing instances. Each health monitoring module shares its locally collected health statistics with every other health monitoring module. Each health monitoring module provides the shared health statistics, on all virtual computing instances within the data center, to a local load balancing module located within the hypervisor of each host computer. Each load balancing module uses health statistics of all virtual computing instances to load balance packets within the data center.

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a protruding trim structure having walls that define a cavity, where the protruding trim structure is capable of carrying an electronic component within the cavity. The enclosure further includes a support plate that is coupled to the enclosure and the protruding trim structure, and a brace structure that secures and supports the protruding trim structure such that when the protruding trim structure is exposed to an external load during a drop event, the protruding trim structure is capable of redirecting an amount of the load away from the protruding trim structure and the electronic component.

Abstract: An approach for securing a DHCP server against unauthorized client attacks in a SDN environment is presented. In an embodiment, a method comprises: determining a count of sub-interfaces implemented on an interface card of a virtual machine; setting a count of unique client identifiers for the virtual machine to zero; determining whether a dynamic host configuration protocol (DHCP) request has been received from the virtual machine; in response to determining that a DHCP request has been received from the virtual machine, incrementing the count of unique client identifiers; determining whether the count of unique client identifiers exceeds the count of sub-interfaces implemented on the interface card of the virtual machine; and in response to determining that the count of unique client identifiers does not exceed the count of sub-interfaces implemented on the interface card of the virtual machine, forwarding the DHCP request to an uplink port.

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a protruding trim structure having walls that define a cavity, where the protruding trim structure is capable of carrying an electronic component within the cavity. The enclosure further includes a support plate that is coupled to the enclosure and the protruding trim structure, and a brace structure that secures and supports the protruding trim structure such that when the protruding trim structure is exposed to an external load during a drop event, the protruding trim structure is capable of redirecting an amount of the load away from the protruding trim structure and the electronic component.

Abstract: The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). In one embodiment a process kit for use in an atomic layer deposition (ALD) chamber is disclosed and includes a dielectric window, a sealing frame, and a mask frame connected with the sealing frame, wherein the mask frame has a gas inlet channel and a gas outlet channel formed therein on opposing sides thereof.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: A computer method and system to allow reconciliation of documents that were originally part of a first mail production job, but that may have been produced as part of a different second mail production job. A database stores a first record that identifies documents in the first mail production job. The record includes one or more fields indicating a production status of the documents in the first mail production job. At some point in the production process, a document is separated from what was originally defined as the first mail production job, to be instead produced as part of a second mail production job. The database further stores a second record identifying documents in the second mail production job. These records are updated to include a pointer indicating the relationship between the document and the first mail production job and the second mail production job. During mail production the production status of a document is determined.

Abstract: An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.

Abstract: The embodiments of the disclosure may generally provide a method and apparatus for forming thin film transistor device that includes an indium gallium zinc oxide (IGZO) layer using a multi-component precursor gas. The embodiments of the disclosure may provide a plasma enhanced chemical vapor deposition system configured to form an IGZO layer on large area substrates. However, it should be understood that the disclosure has utility in other system configurations such other types of chemical vapor deposition systems and any other system in which distributing a multi-component precursor gas to and within a process chamber is desired.

Abstract: Techniques and mechanisms for managing a delivery of power to a resource of an input/output (I/O) interface. In an embodiment, a first link of a plurality of communication links is monitored. Of the plurality of links, a first set of resources of the I/O interface is to support communication only via the first link. One or more other resources of the I/O interface are for supporting communications of another link of the plurality of links. In another embodiment, a resource of the first set of resources is decoupled from a power supply in response to detecting a total number of active lanes of the first link, decoupling.