Patents by Inventor Srikrishna Sitaraman

Srikrishna Sitaraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11579019
    Abstract: A battery-free sensor probe and system for measuring the temperature of food The sensor probe includes a probe portion and a handle. The probe portion has a temperature sensor, a circuit board and a radio frequency identification device. The handle has an antenna connected to radio frequency identification device and the circuit board. The sensor probe harvests energy from a radio frequency transmitter positioned near the sensor probe.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: February 14, 2023
    Assignee: TE Connectivity Solutions GmbH
    Inventors: Srikrishna Sitaraman, Michael Paul Pacheco, Cristian S. Regus
  • Publication number: 20210048347
    Abstract: A battery-free sensor probe and system for measuring the temperature of food The sensor probe includes a probe portion and a handle. The probe portion has a temperature sensor, a circuit board and a radio frequency identification device. The handle has an antenna connected to radio frequency identification device and the circuit board. The sensor probe harvests energy from a radio frequency transmitter positioned near the sensor probe.
    Type: Application
    Filed: July 30, 2020
    Publication date: February 18, 2021
    Inventors: Srikrishna Sitaraman, Michael Paul Pacheco, Cristian S. Regus
  • Publication number: 20160113108
    Abstract: A electromagnetic interference shielding device is disclosed having a first substrate one or more surfaces. One or more laminates are operatively attached to the one or more surfaces of the first substrate. A cavity is provided that is defined by the first substrate and its corresponding one or more laminates and at least one inner lateral portion. The cavity is operable to receive one or more microelectromechanical system (MEMS) components. A first conductive structure integrally formed with a trench or via array of the substrate spans a thickness defined by one or more of surfaces of the first substrate, the first conductive structure operable to shield electromagnetic interference between MEMS components assembled with the first substrate.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 21, 2016
    Applicant: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Venkatesh SUNDARAM, Sung-Jin Kim, Fuhan Liu, Srikrishna Sitaraman, Rao R. Tummala