Abstract: An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a polymer material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. A combination of a cover lens material of the cover lens and the polymer material of the axially elongated enclosure assists with heat dissipation from the light fixture, thereby allowing the LED driver module and the at least one axially elongated linear printed circuit board with LED components to operate within a target peak temperature limit for the hazardous location.

Abstract: Provided in the present invention is an explosion-proof lighting device, comprising: a device body for accommodating the explosion-proof lighting device, the device body comprising a mounting portion located in the middle portion thereof and a first heat dissipation portion and a second heat dissipation portion that extend from the bottom of the mounting portion to two sides; a plurality of light emitting diodes (LEDs) for emitting light to illuminate; an electrical drive module for powering the light emitting diodes; and a seal cover detachably connected to the device body from the bottom thereof.

Abstract: Provided in the present invention is an explosion-proof lighting device, comprising: a device body for accommodating the explosion-proof lighting device, the device body comprising a mounting portion located in the middle portion thereof and a first heat dissipation portion and a second heat dissipation portion that extend from the bottom of the mounting portion to two sides; a plurality of light emitting diodes (LEDs) for emitting light to illuminate; an electrical drive module for powering the light emitting diodes; and a seal cover detachably connected to the device body from the bottom thereof.

Abstract: An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a glassfiber reinforced plastic material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. The LED driver module and the at least one axially elongated linear LED module are operable within a target peak temperature limit for the hazardous location, without utilizing heat sinks to dissipate heat in order to provide acceptable thermal management.

Abstract: Provided in the present invention is an explosion-proof lighting device, comprising: a device body for accommodating the explosion-proof lighting device, the device body comprising a mounting portion located in the middle portion thereof and a first heat dissipation portion and a second heat dissipation portion that extend from the bottom of the mounting portion to two sides; a plurality of light emitting diodes (LEDs) for emitting light to illuminate; an electrical drive module for powering the light emitting diodes; and a seal cover detachably connected to the device body from the bottom thereof.

Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.

Abstract: An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a glassfiber reinforced plastic material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. The LED driver module and the at least one axially elongated linear LED module are operable within a target peak temperature limit for the hazardous location, without utilizing heat sinks to dissipate heat in order to provide acceptable thermal management.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light The enclosure (22) has a shape of a standard incandescent lamp.

Abstract: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

Abstract: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

Abstract: An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.