Abstract: A method for data processing includes displaying, at a user interface, a plurality of attributes that are defined by a data model configured for a tenant of a multi-tenant system. The plurality of attributes includes a one-to-many attribute that is configured to support multiple inputs and a direct attribute configured to support a single input. The method may further include receiving a selection of a first one-to-many attribute for defining an expression for identifying a segment of entities. The method may further include activating, for selection at the user interface, a subset of the attributes based on each attribute of the subset being dependent on the first attribute. The method may further include receiving an indication of the expression, executing a database query to identify the segment of entities, and transmitting, to a content communication system, an indication of the segment of entities.

Abstract: A method for data processing includes displaying, at a user interface, a plurality of attributes that are defined by a data model configured for a tenant of a multi-tenant system. The plurality of attributes includes a one-to-many attribute that is configured to support multiple inputs and a direct attribute configured to support a single input. The method may further include receiving a selection of a first one-to-many attribute for defining an expression for identifying a segment of entities. The method may further include activating, for selection at the user interface, a subset of the attributes based on each attribute of the subset being dependent on the first attribute. The method may further include receiving an indication of the expression, executing a database query to identify the segment of entities, and transmitting, to a content communication system, an indication of the segment of entities.

Abstract: A method for data processing includes displaying, at a user interface, a plurality of attributes that are defined by a data model configured for a tenant of a multi-tenant system. The plurality of attributes includes a one-to-many attribute that is configured to support multiple inputs and a direct attribute configured to support a single input. The method may further include receiving a selection of a first one-to-many attribute for defining an expression for identifying a segment of entities. The method may further include activating, for selection at the user interface, a subset of the attributes based on each attribute of the subset being dependent on the first attribute. The method may further include receiving an indication of the expression, executing a database query to identify the segment of entities, and transmitting, to a content communication system, an indication of the segment of entities.

Abstract: A method for data processing includes displaying, at a user interface, a plurality of attributes that are defined by a data model configured for a tenant of a multi-tenant system. The plurality of attributes includes a one-to-many attribute that is configured to support multiple inputs and a direct attribute configured to support a single input. The method may further include receiving a selection of a first one-to-many attribute for defining an expression for identifying a segment of entities. The method may further include activating, for selection at the user interface, a subset of the attributes based on each attribute of the subset being dependent on the first attribute. The method may further include receiving an indication of the expression, executing a database query to identify the segment of entities, and transmitting, to a content communication system, an indication of the segment of entities.

Abstract: A method for data processing includes identifying, for communication of a content object, a segment of entities including entities of a first entity class of a plurality of entity classes defined by a data model that is configured for a tenant of a multi-tenant system, where the data model defines relationships between entity classes of the plurality of entity classes. The method may further include activating for selection at a user interface at least one second entity class that is related to the first entity class based on the relationships and identifying a set of additional entities of the second entity class from the remaining entities that are related to the segment of entities as defined by the data model. The method may include transmitting to a content communication system an indication of the plurality of entity identifiers corresponding to a modified segment of entities that includes the additional entities.

Abstract: A method for data processing includes identifying, for communication of a content object, a segment of entities including entities of a first entity class of a plurality of entity classes defined by a data model that is configured for a tenant of a multi-tenant system, where the data model defines relationships between entity classes of the plurality of entity classes. The method may further include activating for selection at a user interface at least one second entity class that is related to the first entity class based on the relationships and identifying a set of additional entities of the second entity class from the remaining entities that are related to the segment of entities as defined by the data model. The method may include transmitting to a content communication system an indication of the plurality of entity identifiers corresponding to a modified segment of entities that includes the additional entities.

Abstract: A method for data processing includes displaying, at a user interface, a plurality of attributes that are defined by a data model configured for a tenant of a multi-tenant system. The plurality of attributes includes a one-to-many attribute that is configured to support multiple inputs and a direct attribute configured to support a single input. The method may further include receiving a selection of a first one-to-many attribute for defining an expression for identifying a segment of entities. The method may further include activating, for selection at the user interface, a subset of the attributes based on each attribute of the subset being dependent on the first attribute. The method may further include receiving an indication of the expression, executing a database query to identify the segment of entities, and transmitting, to a content communication system, an indication of the segment of entities.

Abstract: A device may receive information associated with a set of chat logs. The device may obtain context information associated with the information, wherein the context information identifies a network address associated with a participant of the set of chat logs. The device may determine whether the set of chat logs is to be assigned to a first category, a second category, or a third category, wherein the first category is associated with fraudulent chat logs, wherein the second category is associated with chat logs involving a misrepresentation, and wherein the third category is associated with chat logs that are not identified as fraudulent or involving a misrepresentation. The device may perform an action based on whether the set of chat logs is assigned to the first category, the second category, or the third category.

Abstract: A device may receive information associated with a set of chat logs. The device may obtain context information associated with the information, wherein the context information identifies a network address associated with a participant of the set of chat logs. The device may determine whether the set of chat logs is to be assigned to a first category, a second category, or a third category, wherein the first category is associated with fraudulent chat logs, wherein the second category is associated with chat logs involving a misrepresentation, and wherein the third category is associated with chat logs that are not identified as fraudulent or involving a misrepresentation. The device may perform an action based on whether the set of chat logs is assigned to the first category, the second category, or the third category.

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 W/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60W/cm2).