Patents by Inventor Srinivas Raman

Srinivas Raman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113047
    Abstract: Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Srinivasan Raman, Brandon C. Marin, Suddhasattwa Nad, Gang Duan, Benjamin Duong, Srinivas Venkata Ramanuja Pietambaram, Kripa Chauhan
  • Publication number: 20240113046
    Abstract: Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Jason Scott Steill, Shayan Kaviani, Srinivas Venkata Ramanuja Pietambaram, Suddhasattwa Nad, Benjamin Duong, Srinivasan Raman, Yi Yang
  • Publication number: 20240113048
    Abstract: Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Srinivasan Raman, Benjamin Duong, Jason Scott Steill, Shayan Kaviani, Srinivas Venkata Ramanuja Pietambaram, Suddhasattwa Nad, Brandon C. Marin, Gang Duan, Yi Yang
  • Patent number: 5555398
    Abstract: A system and method for guaranteeing coherency between a write back cache and main memory in a computer system that does not have the bus level signals for a conventional write back cache memory. Cache coherency can be maintained by writing back all modified data in the cache prior to execution of the command that initiate the DMA or Bus Master transfer to or from main memory. When bus snooping logic detects writes from the CPU, the cache and main memory are synchronized. After synchronization, the bus snooper continues to look for access hits to modified data in the cache. If hits occurs and it is a DMA cycle, the CPU is prevented from further accesses to cache until after the DMA transfer, modified bytes are written back to main memory. If it is a bus master device seeking access to main memory, the CPU is prevented from further accesses to cache until the modified bytes are written back to main memory.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: September 10, 1996
    Assignee: Intel Corporation
    Inventor: Srinivas Raman
  • Patent number: 5379308
    Abstract: The present invention provides an access mechanism for the testing of modules within an integrated circuit. A test access architecture is implemented which allows embedded testing of reusable modules with reusable test vectors regardless of the configuration of the integrated circuit. Modules within the integrated circuit may receive previously developed test vectors directly from a test input bus without having to propagate them through intervening modules. The module is controlled to accept as input either normal system inputs or the previously developed test vectors by logic circuits embedded within each module. The module's output is routed by a test output bus for dynamically observing test results at the system pins.
    Type: Grant
    Filed: April 20, 1992
    Date of Patent: January 3, 1995
    Assignee: Intel Corporation
    Inventors: Hang T. T. Nhuyen, Srinivas Raman