Patents by Inventor Srinivas REDDY B.M.

Srinivas REDDY B.M. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB
    Publication number: 20240314923
    Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment, the multi-layer shield comprises a metallic layer with a first surface and a second surface opposite from the first surface, and a conductive adhesive over the first surface of the metallic layer. In an embodiment, a base layer is over the second surface of the metallic layer, where the base layer is electrically insulating.
    Type: Application
    Filed: March 17, 2023
    Publication date: September 19, 2024
    Inventors: Arumanayagam RAJASEKAR, Hariharan KALIYAVARATHAN, Srinivas REDDY B.M., Yagnesh Vinodrai WAGHELA, Piyush BHATT