Patents by Inventor Srinivas Thota

Srinivas Thota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327801
    Abstract: Some embodiments include apparatuses and electrical models associated with the apparatus. One of the apparatuses includes an integrated circuit having a die; a package substrate; first conductive connections coupled between the die and a first side of the package substrate; second conductive connections located on a second side of the package substrate opposite from the first side. The second conductive connections are coupled to the first conductive connections through conductive paths in the package substrate. The first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package. The electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections.
    Type: Application
    Filed: June 26, 2021
    Publication date: October 21, 2021
    Inventors: Xing Jian Cai, Chi-Te Chen, Wei Qian, Yihong Yang, Jue Chen, Long Wang, Chung-Hao Joseph Chen, Su Mi Sam, Srinivas Thota
  • Patent number: 10671133
    Abstract: An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: June 2, 2020
    Assignee: Intel Corporation
    Inventors: Sandeep K. Venishetti, Sanjeev S. Jahagirdar, Srinivas Thota
  • Publication number: 20190155350
    Abstract: An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: Sandeep K. Venishetti, Sanjeev S. Jahagirdar, Srinivas Thota
  • Patent number: 10216240
    Abstract: An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: February 26, 2019
    Assignee: Intel Corporation
    Inventors: Sandeep K. Venishetti, Sanjeev S. Jahagirdar, Srinivas Thota
  • Publication number: 20170139454
    Abstract: An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.
    Type: Application
    Filed: January 26, 2017
    Publication date: May 18, 2017
    Inventors: Sandeep K. Venishetti, Sanjeev S. Jahagirdar, Srinivas Thota
  • Patent number: 9588559
    Abstract: An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: March 7, 2017
    Assignee: Intel Corporation
    Inventors: Sandeep K. Venishetti, Sanjeev S. Jahagirdar, Srinivas Thota
  • Publication number: 20150177798
    Abstract: An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.
    Type: Application
    Filed: December 23, 2013
    Publication date: June 25, 2015
    Inventors: Sandeep K. Venishetti, Sanjeev S. Jahagirdar, Srinivas Thota