Abstract: Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.

Abstract: Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

Abstract: Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

Abstract: In one embodiment, a method includes, by a computing system of a vehicle, determining a first temperature of a control unit of the vehicle, wherein the control unit and one or more components of the vehicle are interconnected through a thermal network, determining a thermal objective for the control unit based on the first temperature of the control unit, selecting, based on the thermal objective for the control unit, at least a first component from the one or more components, and sending one or more signals to one or more actuators within the thermal network to enable a heat-transfer fluid to flow between (1) a first portion of the thermal network thermally coupled to the control unit and (2) a second portion of the thermal network thermally coupled to the selected first component.

Abstract: Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

Abstract: Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

Abstract: Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

Abstract: Systems, methods, and non-transitory computer-readable media provide a cooling component including an underbody wheel well fan that is installed in proximity to the wheel well at each side of the front wheels. Specifically, an apparatus for vehicle radiator cooling control is provided, including a first suction component disposed in proximity to a first wheel well at a first side of a vehicle, a first tube component having a first end connected to the first suction component and a second end extended to a direction towards a back of the vehicle, and a first fan component connected to the second end of the first tube component.

Abstract: Systems and methods are provided for vehicle processing component cooling. A vehicle may include a compartment, a computing system including one or more processing components located within the compartment, and a cooling system configured to cool the one or more processing components. The cooling system may include a heat exchanger defining a plurality of flow channels. Each flow channel may be defined by an outlet and may be configured to provide cooling fluid. Operation of the processing components may heat the surrounding cabin air within the compartment through an air cooling operation. The cabin air from within the compartment may be directed through the heat exchanger to cool the cooling fluid. The compartment may be a trunk of the vehicle, and the heat exchanger may be located within the trunk and near the processing components.

Abstract: Systems, methods, and non-transitory computer-readable media provide a cooling component including an underbody wheel well fan that is installed in proximity to the wheel well at each side of the front wheels. Specifically, an apparatus for vehicle radiator cooling control is provided, including a first suction component disposed in proximity to a first wheel well at a first side of a vehicle, a first tube component having a first end connected to the first suction component and a second end extended to a direction towards a back of the vehicle, and a first fan component connected to the second end of the first tube component.

Abstract: Systems, methods, and non-transitory computer-readable media provide a provide an apparatus for initializing cooling circulation with a de-gas pumping system in a vehicle. The apparatus includes a de-gas tank filled with cooling liquid, disposed at a first height within a chamber of the vehicle, a pump connected with the de-gas tank via a pipe, disposed at a second height lower than the first height within the chamber, and a filling reservoir disposed in proximity to the pump and at a substantially similar height with the second height within the chamber.

Abstract: In one embodiment, the apparatus includes a temperature-controlled enclosure for a sensing device comprising insulating air gaps, a fan, and a heatsink. The enclosure maintains the sensing device within a desired operating temperature range while operating in automotive environments with high ambient temperatures and solar radiation. The enclosure is configured to be securely affixed to an automobile interior and has a configuration of temperature-control systems which allows for unimpeded functioning of the sensing device's communications hardware.

Abstract: In one embodiment, the apparatus includes a system for harvesting energy and cooling an automotive sensing unit, the system comprising a solar-energy collecting panel, a turbine, and an electrical energy storage device. The solar-energy collecting panel shields the sensor device from solar irradiation while converting solar energy to electrical energy for storage in the storage device. The turbine converts convective heat flow from the sensor device into electrical energy for storage in the storage device. The stored electrical energy in the storage device can be further used to power an active cooling system for the sensor device. The stored electrical energy can also be further used to power other systems of the host vehicle.

Abstract: In one embodiment, a method includes, by a computing system of a vehicle, determining a first temperature of a control unit of the vehicle, wherein the control unit and one or more components of the vehicle are interconnected through a thermal network, determining a thermal objective for the control unit based on the first temperature of the control unit, selecting, based on the thermal objective for the control unit, at least a first component from the one or more components, and sending one or more signals to one or more actuators within the thermal network to enable a heat-transfer fluid to flow between (1) a first portion of the thermal network thermally coupled to the control unit and (2) a second portion of the thermal network thermally coupled to the selected first component.

Abstract: In one embodiment, the apparatus includes a temperature-controlled enclosure for a sensing device comprising insulating air gaps, a fan, and a heatsink. The enclosure maintains the sensing device within a desired operating temperature range while operating in automotive environments with high ambient temperatures and solar radiation. The enclosure is configured to be securely affixed to an automobile interior and has a configuration of temperature-control systems which allows for unimpeded functioning of the sensing device's communications hardware.

Abstract: A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.

Abstract: A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.