Patents by Inventor Srinivasam Sivaram

Srinivasam Sivaram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5604158
    Abstract: A method of filling an opening in an insulating layer of an integrated circuit. First a tungsten-silicide layer is deposited over the opening. Next a tungsten layer is deposited onto the tungsten-silicide layer such that the opening is substantially filed with tungsten. The tungsten and tungsten-silicide layer are then chemically-mechanically polished back until the insulating layer is substantially revealed.
    Type: Grant
    Filed: April 16, 1996
    Date of Patent: February 18, 1997
    Assignee: Intel Corporation
    Inventors: Kenneth C. Cadien, Srinivasam Sivaram