Patents by Inventor Srinivasan Anand

Srinivasan Anand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free semiconductor package
    Publication number: 20060289977
    Abstract: A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.
    Type: Application
    Filed: June 27, 2005
    Publication date: December 28, 2006
    Inventors: Raj Master, Srinivasan Anand, Srinivasan Parthasarathy, Yew Mui
  • Method for assigning communication resources in a communication system
    Patent number: 6219840
    Abstract: A method for assigning communication resources includes assigning communication resources (216, 218, 220) in the nature of bandwidth according to various selection schemes based upon the type of communication service being provided, and based upon the nature of the service area (128, 130) and subscriber premises (132, 134).
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: April 17, 2001
    Assignee: Motorola, Inc.
    Inventors: Richard J. Corrigan, Alan Lee Grau, Kurt Steinbrenner, Srinivasan Anand