Patents by Inventor Srinivasan Duraiswamy

Srinivasan Duraiswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer matrices functionalized with carbon-containing species for enhanced thermal conductivity
    Patent number: 9260646
    Abstract: Disclosed are thermally conductive composites that include a polymer matrix functionalized with a carbon-containing species covalently coupled with the polymer matrix. Also disclosed are methods that generally include functionalizing a carbon-containing species and incorporating the functionalized carbon-containing species into the polymer, such that the carbon-containing species are covalently bonded to the polymer matrix via a coupling agent.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 16, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Sumana Roy Chowdhury, Padma Priya Sudharshana, Srinivasan Duraiswamy
  • THERMALLY CONDUCTIVE POLYMER COMPOSITES CONTAINING MAGNESIUM SILICATE AND BORON NITRIDE
    Publication number: 20150225636
    Abstract: A polymer composition is taught and claimed, the composition comprising polymer, boron nitride and magnesium silicate, wherein the composition has certain thermal conductivity and dielectric properties. Additionally, the composition may be injection moldable.
    Type: Application
    Filed: April 24, 2015
    Publication date: August 13, 2015
    Inventors: Manjunatha Hosahalli Ramachandraiah, Sreejith Valiavalappil, Chitradurga L. Rao Aravinda, Srinivasan Duraiswamy
  • POLYMER MATRICES FUNCTIONALIZED WITH CARBON-COATING SPECIES FOR ENHANCED THERMAL CONDUCTIVITY
    Publication number: 20150014577
    Abstract: Disclosed are thermally conductive composites that include a polymer matrix functionalized with a carbon-containing species covalently coupled with the polymer matrix. Also disclosed are methods that generally include functionalizing a carbon-containing species and incorporating the functionalized carbon-containing species into the polymer, such that the carbon-containing species are covalently bonded to the polymer matrix via a coupling agent.
    Type: Application
    Filed: September 23, 2014
    Publication date: January 15, 2015
    Inventors: Sumana Roy Chowdhury, Padma Priya Sudharshana, Srinivasan Duraiswamy
  • ECO-DISHWASHER SYSTEM AND METHODOLOGY
    Publication number: 20130263892
    Abstract: A dishwashing apparatus and a methodology are provided for washing dishware using electrolyzed water to provide alkaline and acidic water for wash and rinse cycles. The water used at the beginning of a pre-wash stage is repeatedly used in plural pre-wash cycles and filtered through sediment and oil filtration between pre-wash cycles. Water from a final rinse cycle is saved for use for future pre-wash cycles. The sediment and oil filtration filter are reversely flushed to regenerate the filtration systems.
    Type: Application
    Filed: December 21, 2010
    Publication date: October 10, 2013
    Applicant: General Electric Company
    Inventors: Ramasamy Thiyagarajan, Ronald Scott Tarr, Hai Yang, Paul Mathew, Chen Wang, Mahesh Kumar Asati, Hui Lei, Zijun Xia, Nikhil Subhashchandra Tambe, Srinivasan Duraiswamy
  • Highly thermally-conductive moldable thermoplastic composites and compositions
    Patent number: 8299159
    Abstract: Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: October 30, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Bukkinakere Kapanipathaiya Chandrasekhar, Manjunatha Hosahalli Ramachandraiah, Bambore Lokeshwarappa Santhosh Kumar, Srinivasan Duraiswamy
  • HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS
    Publication number: 20110040007
    Abstract: Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications.
    Type: Application
    Filed: May 4, 2010
    Publication date: February 17, 2011
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Bukkinakere Kapanipathaiya Chandrasekhar, Manjunatha Hosahalli Ramachandraiah, Bambore Lokeshwarappa Santhosh Kumar, Srinivasan Duraiswamy