Abstract: An electronics equipment cabinet includes multiple cabinet walls defining an interior enclosure space for housing at least one electronic device, an outer wall positioned to shield from solar radiation an outer surface of at least one of the multiple cabinet walls, and at least one divider wall positioned between the outer wall and the cabinet wall to define first and second channels. The cabinet wall has two openings to allow internal cabinet air to flow between the interior enclosure space and the first channel, while inhibiting external ambient air from entering the interior enclosure space and the first channel. The outer wall has two openings positioned to allow external ambient air to flow through the second channel to cool the internal cabinet air in the first channel via heat exchange through the divider wall, while inhibiting the external cabinet air from mixing with the internal cabinet air.

Abstract: A computer equipment cabinet cooling system can include a computer equipment cabinet and a cooling sub-system at least partially mounted therein. The cabinet can include multiple equipment bays within an interior space. The cooling sub-system can include one or more fans and/or ducts extending upwardly from a base of the cabinet between the equipment bays. The duct can include one or more vents configured to direct the cold air into the interior space, which can include toward specific portions of the interior space, such as the first and/or second equipment bays.

Abstract: An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

Abstract: An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

Abstract: An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

Abstract: An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

Abstract: An electronics equipment cabinet includes multiple cabinet walls defining an interior enclosure space for housing at least one electronic device, an outer wall positioned to shield from solar radiation an outer surface of at least one of the multiple cabinet walls, and at least one divider wall positioned between the outer wall and the cabinet wall to define first and second channels. The cabinet wall has two openings to allow internal cabinet air to flow between the interior enclosure space and the first channel, while inhibiting external ambient air from entering the interior enclosure space and the first channel. The outer wall has two openings positioned to allow external ambient air to flow through the second channel to cool the internal cabinet air in the first channel via heat exchange through the divider wall, while inhibiting the external cabinet air from mixing with the internal cabinet air.

Abstract: An electronics equipment cabinet includes a plurality of walls defining a first space and a second space adjacent the first space. A wall of the plurality of walls separates the first space and the second space and includes an opening. The cabinet further includes a heat generating module having an inlet side, an outlet side opposing the inlet side, a heat generating component between the inlet side and the outlet side, and an internal fan for directing air heated by the heat generating component into the second space via the opening of the wall. One or more walls of the plurality of walls defining the second space includes a thermally conductive material for transferring heat from the second space to a surrounding environment external to the cabinet to reduce a temperature in the cabinet. Other example cabinets and methods for reducing temperature in cabinets are also disclosed.

Abstract: Hot pressing hollow carbon nanoparticles results in a nano-carbon foam that can be used for energy storage, carbon dioxide capture or water desalination.

Abstract: Hot pressing hollow carbon nanoparticles results in a nano-carbon foam that can be used for energy storage, carbon dioxide capture or water desalination.

Abstract: Hot pressing hollow carbon nanoparticles results in a nano-carbon foam that can be used for energy storage, carbon dioxide capture or water desalination.

Abstract: An electronics equipment cabinet includes a plurality of walls defining a first space and a second space adjacent the first space. A wall of the plurality of walls separates the first space and the second space and includes an opening. The cabinet further includes a heat generating module having an inlet side, an outlet side opposing the inlet side, a heat generating component between the inlet side and the outlet side, and an internal fan for directing air heated by the heat generating component into the second space via the opening of the wall. One or more walls of the plurality of walls defining the second space includes a thermally conductive material for transferring heat from the second space to a surrounding environment external to the cabinet to reduce a temperature in the cabinet. Other example cabinets and methods for reducing temperature in cabinets are also disclosed.