Patents by Inventor Srinivasulu Alampally

Srinivasulu Alampally has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9797948
    Abstract: A multi-die chip module (MCM) comprises a first die containing a first test controller and a second die containing a second test controller coupled to the first die via an interconnect. The first test controller is configured to place the first die in either a shift mode or a capture mode. The second controller is configured to place the second die in either the shift mode or the capture mode. After a scan shift operation, scan cells are initialized to predetermined values. During the capture operation one die remains in the shift mode and the other die enters the capture mode so that as test bits are shifted into registers associated with output pads on the die in the shift mode, the other die is in the capture mode and captures signals on input pads associated with that die, enabling scan based at-speed testing of the interconnect.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: October 24, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Milan Shetty, Srinivasulu Alampally, Prasanth V
  • Publication number: 20150355278
    Abstract: A multi-die chip module (MCM) comprises a first die containing a first test controller and a second die containing a second test controller coupled to the first die via an interconnect. The first test controller is configured to place the first die in either a shift mode or a capture mode. The second controller is configured to place the second die in either the shift mode or the capture mode. After a scan shift operation, scan cells are initialized to predetermined values. During the capture operation one die remains in the shift mode and the other die enters the capture mode so that as test bits are shifted into registers associated with output pads on the die in the shift mode, the other die is in the capture mode and captures signals on input pads associated with that die, enabling scan based at-speed testing of the interconnect.
    Type: Application
    Filed: August 20, 2015
    Publication date: December 10, 2015
    Inventors: Milan Shetty, Srinivasulu Alampally, Prasanth V
  • Patent number: 9140754
    Abstract: A multi-die chip module (MCM) comprises a first die containing a first test controller and a second die containing a second test controller coupled to the first die via an interconnect. The first test controller is configured to place the first die in either a shift mode or a capture mode. The second controller is configured to place the second die in either the shift mode or the capture mode. After a scan shift operation, scan cells are initialized to predetermined values. During the capture operation one die remains in the shift mode and the other die enters the capture mode so that as test bits are shifted into registers associated with output pads on the die in the shift mode, the other die is in the capture mode and captures signals on input pads associated with that die, enabling scan based at-speed testing of the interconnect.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: September 22, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Milan Shetty, Srinivasulu Alampally, V. Prasanth
  • Patent number: 8799713
    Abstract: A built-in self-test (BIST) diagnostic system tests the execution of a processor. The processor is arranged to execute a normal application for controlling a process that is external to the processor. The normal execution is executed in normal execution timeslots that have idle timeslots that are interspersed in time between the normal execution timeslots. A BIST controller is arranged to detect the presence of an idle timeslot in the execution of the processor and to use a scan chain to scan-in a first test pattern for a test application for testing the processor. The first test pattern is executed by the processor during the detected idle timeslot and a first result pattern generated by the execution of the first test pattern is scanned-out. The scanned-out first test pattern is evaluated to determine the presence of an error. The first test pattern application is conditionally interruptible.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: August 5, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Swathi Gangasani, Srinivasulu Alampally, Prohor Chowdhury, Srinivasa B S Chakravarthy, Padmini Sampath, Rubin Ajit Parekhji
  • Patent number: 8286042
    Abstract: This invention generates the random seed patterns using simple, low-area overhead digital circuitry on-chip. This circuit is implemented as a finite state machine whose states are the seeds as contrasted to storing the seeds in the prior art. These seeds are used to control pseudo-random pattern generation for built-in self-tests. This invention provides a large reduction in chip area in comparison with storing seeds on-chip or off-chip.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: October 9, 2012
    Assignee: Texas Instruments Incorporated
    Inventors: Swathi Gangasani, Srinivasulu Alampally, Divya Divakaran, Rubin Ajit Parekhji, Amit Kumar Dutta, Srivaths Ravi
  • Publication number: 20120226942
    Abstract: A built-in self-test (BIST) diagnostic system tests the execution of a processor. The processor is arranged to execute a normal application for controlling a process that is external to the processor. The normal execution is executed in normal execution timeslots that have idle timeslots that are interspersed in time between the normal execution timeslots. A BIST controller is arranged to detect the presence of an idle timeslot in the execution of the processor and to use a scan chain to scan-in a first test pattern for a test application for testing the processor. The first test pattern is executed by the processor during the detected idle timeslot and a first result pattern generated by the execution of the first test pattern is scanned-out. The scanned-out first test pattern is evaluated to determine the presence of an error. The first test pattern application is conditionally interruptible.
    Type: Application
    Filed: February 28, 2012
    Publication date: September 6, 2012
    Applicant: TEXAS INSTRUMENTS, INCORPORATED
    Inventors: Swathi Gangasani, Srinivasulu Alampally, Prohor Chowdhury, Srinivasa B S Chakravarthy, Padmini Sampath, Rubin Ajit Parekhji
  • Publication number: 20120221906
    Abstract: A multi-die chip module (MCM) comprises a first die containing a first test controller and a second die containing a second test controller coupled to the first die via an interconnect. The first test controller is configured to place the first die in either a shift mode or a capture mode. The second controller is configured to place the second die in either the shift mode or the capture mode. After a scan shift operation, scan cells are initialized to predetermined values. During the capture operation one die remains in the shift mode and the other die enters the capture mode so that as test bits are shifted into registers associated with output pads on the die in the shift mode, the other die is in the capture mode and captures signals on input pads associated with that die, enabling scan based at-speed testing of the interconnect.
    Type: Application
    Filed: February 28, 2012
    Publication date: August 30, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Milan SHETTY, Srinivasulu ALAMPALLY, V. PRASANTH
  • Publication number: 20100218059
    Abstract: This invention generates the random seed patterns using simple, low-area overhead digital circuitry on-chip. This circuit is implemented as a finite state machine whose states are the seeds as contrasted to storing the seeds in the prior art. These seeds are used to control pseudo-random pattern generation for built-in self-tests. This invention provides a large reduction in chip area in comparison with storing seeds on-chip or off-chip.
    Type: Application
    Filed: February 22, 2010
    Publication date: August 26, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Swathi Gangasani, Srinivasulu Alampally, Divya Divakaran, Rubin Ajit Parekhji, Amit Kumar Dutta, Srivaths Ravi