Abstract: An apparatus may include (1) a terminal connector configured to be electrically coupled to a power interface of a computing device, (2) an inline terminal block assembly that is independent of the terminal connector, (3) at least one terminal-side power cable configured to be electrically coupled between the terminal connector and the inline terminal block assembly, and (4) at least one distribution-side power cable configured to be electrically coupled between the inline terminal block assembly and a power distribution system.

Abstract: The disclosed apparatus may include (1) a faceplate that facilitates at least one connection between at least one communication cable and a line card that forwards traffic in connection with a network, (2) at least one heatsink that (A) is integrated into the faceplate and (B) absorbs heat dissipated by at least one electronic component included in the line card, and (3) at least one mount that (A) is integrated into the faceplate and (B) enables the electronic component to attach to the heatsink. Various other apparatuses and systems are also disclosed.

Abstract: A printed circuit board assembly utilizing an elevated track to support signal lines between components is disclosed. The track rests on a plurality of vertical supports, placed amid the components, such that the signal lines can be routed after the components are configured on the board. The vertical supports can be installed at grounding holes already present on the printed circuit board assembly. The track is sufficiently rigid to support bundles of signal lines over long spans between vertical supports. The track can be constructed of the same material as the board, to provide the same ESD and conductivity characteristics as the board, as well as ensure that the track does not contribute to the EMI signature of the board.