Patents by Inventor Sriram Srintvasan

Sriram Srintvasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked microvias and method of manufacturing same
    Publication number: 20060289202
    Abstract: A flip chip package may include stacked vias in which the diameter D1 of the outermost via is less than the diameter D2 of the innermost via. The ratio D2/D1, for example, may be 1.5 to 2.
    Type: Application
    Filed: June 24, 2005
    Publication date: December 28, 2006
    Applicant: Intel Corporation
    Inventors: Timothy M. Takeuchi, Sriram Srintvasan, Sandeep B. Sanf