Patents by Inventor Sriram Srninivasan

Sriram Srninivasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patch on interposer assembly and structures formed thereby
    Publication number: 20110156276
    Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
    Type: Application
    Filed: December 31, 2009
    Publication date: June 30, 2011
    Inventors: Brent M. Roberts, Mihir K. Roy, Sriram Srninivasan