Abstract: Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.

Abstract: An electronics system may include a substrate, an electronic device bonded to the substrate, a plurality of photoluminescent particles disposed on the electronic device, an illuminator, a sensor, and a control module. The illuminator can illuminate the electronic device. The sensor can capture a first set of positions of the photoluminescent particles on the electronic device when the electronic device is not operating under a load and a second set of positions of the photoluminescent particles when the electronic device is operating under a load. The control module can determine thermomechanical stress on the electronic device based at least in part on a difference between the first set of positions and the second set of positions.

Abstract: Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.

Abstract: An electronics system may include a substrate, an electronic device bonded to the substrate, a plurality of photoluminescent particles disposed on the electronic device, an illuminator, a sensor, and a control module. The illuminator can illuminate the electronic device. The sensor can capture a first set of positions of the photoluminescent particles on the electronic device when the electronic device is not operating under a load and a second set of positions of the photoluminescent particles when the electronic device is operating under a load. The control module can determine thermomechanical stress on the electronic device based at least in part on a difference between the first set of positions and the second set of positions.