Patents by Inventor Sruthi Samala

Sruthi Samala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tsv wafer with improved fracture strength
    Patent number: 9607929
    Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: March 28, 2017
    Assignee: International Business Machines Corporation
    Inventors: James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson, Charles F. Musante, Sruthi Samala, David C. Thomas
  • Methods of forming a TSV wafer with improved fracture strength
    Patent number: 9312205
    Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: April 12, 2016
    Assignee: International Business Machines Corporation
    Inventors: James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson, Charles F. Musante, Sruthi Samala, David C. Thomas
  • TSV WAFER WITH IMPROVED FRACTURE STRENGTH
    Publication number: 20150348876
    Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.
    Type: Application
    Filed: August 13, 2015
    Publication date: December 3, 2015
    Inventors: James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson, Charles F. Musante, Sruthi Samala, David C. Thomas
  • TSV WAFER FRACTURE STRENGTH
    Publication number: 20150255404
    Abstract: A method including forming a through-substrate via through a thickness of a substrate, the thickness of the substrate is measured from a front side of the substrate to a back side of the substrate, removing a first portion of the substrate to form an opening in the back side of the substrate such that a second portion of the substrate remains in direct contact surrounding a vertical sidewall of the through-substrate via, and filling the opening with an alternate material having a lower modulus of elasticity than the substrate.
    Type: Application
    Filed: March 4, 2014
    Publication date: September 10, 2015
    Applicant: International Business Machines Corporation
    Inventors: James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson, Charles F. Musante, Sruthi Samala, David C. Thomas