Abstract: A portable baking assembly includes a portable housing, a receiving base, and an air flow assembly. The receiving base is disposed in the portable housing. The receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. The air flow assembly is received in the portable housing and in fluid communication with the receiving base. The air flow assembly includes an inlet conduit that is operable to receive heated air and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.

Abstract: An apparatus is provided for improving the cooling of a heat source. The apparatus includes a deflector mounted in a space between a first heat source and a second heat source. The deflector has a first face at a first angle that is greater than perpendicular from a first plane and a second face at a second angle that is less than perpendicular from a second plane. The apparatus further includes a plurality of vanes that extend from the first face of the deflector and are rotated inwardly with respect to the first face. When the first and second heat sources are immersed in a fluid and oriented with the second heat source above the first heat source, as fluid heated by the first heat source rises, the heated fluid is directed by the deflector away from the second plane and is directed by the plurality of vanes toward a center of the deflector.

Abstract: A fluid cleaning apparatus is provided for a computing system. The fluid cleaning apparatus includes a body forming a reservoir in fluid communication with a liquid cooling system. The reservoir is operable to receive fluid from the liquid cooling system. A cleaning unit is operable to reduce bacterial growth in the fluid received in the reservoir. A return component is in fluid communication with the reservoir and the liquid cooling system such that the fluid in the reservoir flows back into the liquid cooling system.

Abstract: An apparatus and system provide coolant temperature data at the individual electronic device level, e.g., for a single server blade, using thermally conductive couplers positioned in-line with one or both of the fluid inlet and outlet tubes and temperature sensors in thermal contact with the couplers. Thus, provided with granular coolant temperature data at the device level, the cooling system, e.g., fan and/or pump speeds, may be controlled with the same level of granularity, thereby improving both temperature control and the conservation of energy.

Abstract: An apparatus is provided for completing a blind mate hydraulic connection. A device is equipped at the rear of the device with a shell holding a manifold connected internally to the device cooling system. Clearances between the shell and manifold allow the manifold to rotate in two axes to adapt to a misalignment between the manifold and a rack cooling system. The device is further provided with a cam-handle attached to the front that provides leverage against the rack for overcoming the connection forces of the blind mate. The manifold and cam-handle combine to facilitate disconnecting the device from the rack cooling system from the front of the rack and servicing the device.

Abstract: A fluid control apparatus can include a housing and a drainage hose. The housing can form a chamber operable to receive at least one air vent for a cooling system such that the housing surrounds the air vent and prevents fluid exiting the air vent from passing through the housing. The drainage hose can be fluidly coupled with the housing. The drainage hose can be operable to drain fluid from the chamber of the housing to a drainage tray.

Abstract: A method is provided for dynamically controlling fan speed of a computing system during boot and reboot. The method may include receiving an ambient temperature from a sensor by a controller. The method may also include controlling speed for one or more fans dynamically based upon the ambient temperature using a dynamic algorithm during boot and reboot of the computing system. The dynamic algorithm may include a function for the fan speed of the one or more fans based upon the ambient temperature.

Abstract: A manifold system includes a supply manifold and a return manifold. The supply manifold delivers fluid to cold plates to cool processing units of a computing system. The return manifold receives the fluid from the cold plates. The supply manifold has supply fluid ports equidistantly spaced about the side surface of the supply manifold, and the return manifold has return fluid ports equidistantly spaced about the side surface of the return manifold.

Abstract: A system is provided for collection, detection and containment of leaked liquid. The system may include a spout connected to a liquid cooling manifold for channeling liquid. The system may also include a collection tray positioned under the spout and configured to contain the liquid from the spout. The system may further include a leak detection rope having a first end coupled to the liquid cooling manifold, a middle portion extending along the spout, and a second end placed inside the collection tray for detection of liquid.

Abstract: An apparatus and system are provided for detecting coolant leaks from connections to rack-mounted devices and managing the leak by directing liquid away from sensitive electrical components. On each device, a pan is connected to liquid couplings found on the rear of the device. A sensor tape is attached to a vertical section of the rack, e.g., on the coolant supply lines or housing. The pan collects leakage from the couplings and directs the leakage to the sensor tape, which is connected to a control unit. Upon liquid contacting the sensor tape, the control unit signals the detection of a leak. To prevent false positives due to incidental leakage, e.g., mere drops leaked upon connection to the coolant system, the pan may include a texture in the pan surface that retains a small amount of fluid.

Abstract: A manifold system includes a supply manifold and a return manifold. The supply manifold delivers fluid to cold plates to cool processing units of a computing system. The return manifold receives the fluid from the cold plates. The supply manifold has supply fluid ports equidistantly spaced about the side surface of the supply manifold, and the return manifold has return fluid ports equidistantly spaced about the side surface of the return manifold.

Abstract: A method is provided for dynamically controlling fan speed of a computing system during boot and reboot. The method may include receiving an ambient temperature from a sensor by a controller. The method may also include controlling speed for one or more fans dynamically based upon the ambient temperature using a dynamic algorithm during boot and reboot of the computing system. The dynamic algorithm may include a function for the fan speed of the one or more fans based upon the ambient temperature.

Abstract: A method is provided for dynamically controlling fan speed of a computing system during boot and reboot. The method may include receiving an ambient temperature from a sensor by a controller. The method may also include controlling speed for one or more fans dynamically based upon the ambient temperature using a dynamic algorithm during boot and reboot of the computing system. The dynamic algorithm may include a function for the fan speed of the one or more fans based upon the ambient temperature.

Abstract: A method is provided for dynamically controlling fan speed of a computing system during boot and reboot. The method may include receiving an ambient temperature from a sensor by a controller. The method may also include controlling speed for one or more fans dynamically based upon the ambient temperature using a dynamic algorithm during boot and reboot of the computing system. The dynamic algorithm may include a function for the fan speed of the one or more fans based upon the ambient temperature.

Abstract: A system is provided for collection, detection and containment of leaked liquid. The system may include a spout connected to a liquid cooling manifold for channeling liquid. The system may also include a collection tray positioned under the spout and configured to contain the liquid from the spout. The system may further include a leak detection rope having a first end coupled to the liquid cooling manifold, a middle portion extending along the spout, and a second end placed inside the collection tray for detection of liquid.

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Abstract: Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.