Abstract: Disclosed is a method for inspecting a flat panel. The method for inspecting the flat panel includes the steps of: arranging a camera at a measurement location of the flat panel by horizontally moving at least one of the flat panel and the camera; automatically focusing the camera with respect to a measuring target of the flat panel at the measurement location; acquiring a plurality of images for the measuring target by vertically moving the focused camera within a set region on the basis of the present location of the camera when focusing the camera; selecting the image having the most definition for the measuring target among the acquired images; processing the selected image; and determining whether the measuring target is defective or not.

Abstract: Provided are a method of transmitting and receiving image data with high speed, which includes sequentially transmitting image data output from an image sensor through one or more transmission channels with a speed corresponding to a bandwidth of the transmission channels, and sequentially recording image data received through one or more transmission channels in a frame store with a speed corresponding to a total bandwidth obtained by summing bandwidths of the respective one or more transmission channels, and an apparatus for implementing the method.

Abstract: An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

Abstract: Disclosed is a method for inspecting a flat panel. The method for inspecting the flat panel includes the steps of: arranging a camera at a measurement location of the flat panel by horizontally moving at least one of the flat panel and the camera; automatically focusing the camera with respect to a measuring target of the flat panel at the measurement location; acquiring a plurality of images for the measuring target by vertically moving the focused camera within a set region on the basis of the present location of the camera when focusing the camera; selecting the image having the most definition for the measuring target among the acquired images; processing the selected image; and determining whether the measuring target is defective or not.

Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

Abstract: The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.

Abstract: Provided are a method of transmitting and receiving image data with high speed, which includes sequentially transmitting image data output from an image sensor through one or more transmission channels with a speed corresponding to a bandwidth of the transmission channels, and sequentially recording image data received through one or more transmission channels in a frame store with a speed corresponding to a total bandwidth obtained by summing bandwidths of the respective one or more transmission channels, and an apparatus for implementing the method.

Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

Abstract: The surface shape measuring system includes an illumination unit including a main light source, a focusing lens, and a projection lens; a beam splitter to split illumination light emitted respectively irradiated onto a reference surface and a measurement surface; a light detecting element to capture an interference pattern; and a control computer to obtain surface shape data through white-light interference pattern analysis from an image captured and detect whether or not the measurement surface is defective from the obtained data, wherein a subsidiary light source to provide falling illumination to the target object; and two-dimensional data and three-dimensional data regarding the surface shape of the target object are obtained by selectively intermitting the turning-on of the main light source and the subsidiary light source and the irradiation of the illumination light onto the reference surface.

Abstract: An image measuring apparatus for enhancing an accuracy of an image captured by an optical system and a method thereof are disclosed. The apparatus includes a CCD camera for capturing the object and outputting the captured image, a lamp for generating white light to illuminate a capturing area of the object, an illumination controller for controlling the lamp to be turned on, a piezoelectric actuator for controlling a minute height of the optical system with respect to the object, an image capturing device for acquiring the image captured by the CCD camera, a driving signal generator for outputting a driving signal to the illumination controller and the piezoelectric actuator when an enable signal is generated from the CCD camera, and an image signal processor for estimating height information of the object from data transmitted from the image capturing unit.

Abstract: An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

Abstract: The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.

Abstract: The surface shape measuring system includes an illumination unit including a main light source, a focusing lens, and a projection lens; a beam splitter to split illumination light emitted respectively irradiated onto a reference surface and a measurement surface; a light detecting element to capture an interference pattern; and a control computer to obtain surface shape data through white-light interference pattern analysis from an image captured and detect whether or not the measurement surface is defective from the obtained data, wherein a subsidiary light source to provide falling illumination to the target object; and two-dimensional data and three-dimensional data regarding the surface shape of the target object are obtained by selectively intermitting the turning-on of the main light source and the subsidiary light source and the irradiation of the illumination light onto the reference surface.

Abstract: A 3D shape measuring apparatus is disclosed, which is capable of simultaneously obtaining interference fringes of the lowest point and the highest point, by comprising a reflection path controller that generates a reference plane reflection path equal to a reflection path from a lowest point, and a reference plane reflection path equal to a reflection path from a highest point, the lowest and the highest points of a measured object having a height difference.

Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

Abstract: An image measuring apparatus for acquiring an image captured by an optical system and a method thereof are disclosed. The apparatus includes a CCD camera for capturing the object and outputting the captured image, a lamp for generating light to illuminate a capturing area of the object, an illumination controller for controlling the lamp to be turned on, a projection grating formed with gratings, a projection grating driving unit for adjusting a distance between the projection grating and the object, an image capturing device for acquiring the image captured by the CCD camera, a driving signal generator for outputting a driving signal to the illumination controller, the projection grating driving unit, and the image capturing unit simultaneously according to an enable signal generated from the CCD camera, and an image signal processor for estimating a three-dimensional image of the object from data transmitted from the image capturing unit.

Abstract: An image measuring apparatus for enhancing an accuracy of an image captured by an optical system and a method thereof are disclosed. The apparatus includes a CCD camera for capturing the object and outputting the captured image, a lamp for generating white light to illuminate a capturing area of the object, an illumination controller for controlling the lamp to be turned on, a piezoelectric actuator for controlling a minute height of the optical system with respect to the object, an image capturing device for acquiring the image captured by the CCD camera, a driving signal generator for outputting a driving signal to the illumination controller and the piezoelectric actuator when an enable signal is generated from the CCD camera, and an image signal processor for estimating height information of the object from data transmitted from the image capturing unit.

Abstract: A method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object. The method and apparatus for measuring the three-dimensional surface shape of the object, in which a real-time measurement of the three-dimensional surface is performed by projecting a beam of light having color information onto the object and detecting color distribution information according to levels of the object, thereby obtaining level information of the object.

Abstract: An apparatus and method for measuring a three-dimensional shape of an object using a projection moiré device. The method comprises the steps of obtaining a grid pattern image projected on a reference plane of a moving table and applying a buckets algorithm thereto, thereby achieving a reference phase, obtaining a grid pattern image projected on the object set on the moving table and applying a buckets algorithm thereto, thereby achieving an object phase, calculating a difference phase between the object phase and the reference phase, thereby achieving a moiré phase, and unwrapping the moiré phase, thereby achieving a level information of the object. The apparatus and method measure the three-dimensional shape using a projection grid without a reference grid, thereby achieving compactness of equipment, simplicity in usage and manufacturing cost reduction.

Abstract: A method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object. The method and apparatus for measuring the three-dimensional surface shape of the object, in which a real-time measurement of the three-dimensional surface is performed by projecting a beam of light having color information onto the object and detecting color distribution information according to levels of the object, thereby obtaining level information of the object.